- 您现在的位置：买卖IC网 > PDF目录45202 > MB9BF517TPMC (FUJITSU LTD) 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP176 PDF资料下载
参数资料
| 型号： | MB9BF517TPMC |
| 厂商： | FUJITSU LTD |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP176 |
| 封装： | 24 X 24 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, LQFP-176 |
| 文件页数： | 79/124页 |
| 文件大小： | 1191K |
| 代理商： | MB9BF517TPMC |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页当前第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页
58
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r1.1
MB9B510T Series
DS706-00019-0v01-E
·
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards
in the design of products.
·
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment
such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions.
·
Precautions Related to Usage of Devices
FUJITSU SEMICONDUCTOR semiconductor devices are intended for use in standard applications
(computers, office automation and other office equipment, industrial, communications, and measurement
equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or
abnormal operation may directly affect human lives or cause physical injury or property damage, or where
extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea
floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult
with sales representatives before such use. The company will not be responsible for damages arising from
such use without prior approval.
2. Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU SEMICONDUCTOR's recommended conditions.
For detailed information about mount conditions, contact your sales representative.
·
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the
soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for
storage temperature. Mounting processes should conform to FUJITSU SEMICONDUCTOR recommended
mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can
lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment
of socket contacts and IC leads be verified before mounting.
·
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. FUJITSU SEMICONDUCTOR recommends the solder
reflow method, and has established a ranking of mounting conditions for each product. Users are advised to
mount packages in accordance with FUJITSU SEMICONDUCTOR ranking of recommended conditions.
相关PDF资料 |
PDF描述 |
|---|---|
| MB9BF517SPMC | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP144 |
| MB9BF518TPMC | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP176 |
| MB9BF516SPMC | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP144 |
| MB9BF518SPMC | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP144 |
| MB9BF617TBGL | 32-BIT, FLASH, RISC MICROCONTROLLER, PBGA192 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MB9BF518SPMC-ESE1 | 制造商:FUJITSU 功能描述: |
| MB9BF518SPMC-GE1 | 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 144LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 144LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 144LQFP; Controller Family/Series:ARM Cortex-M3; Core Size:32bit; No. of I/O's:122; Supply Voltage Min:2.7V; Supply Voltage Max:5.5V; Digital IC Case Style:LQFP; No. of Pins:144; Program Memory Size:1MB; ;RoHS Compliant: Yes |
| MB9BF518TBGL-GE1 | 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 192BGA |
| MB9BF518TPMC-ESE1 | 制造商:FUJITSU 功能描述: |
| MB9BF518TPMC-GE1 | 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 176LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 176LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 176LQFP; Controller Family/Series:ARM Cortex-M3; Core Size:32bit; No. of I/O's:154; Supply Voltage Min:2.7V; Supply Voltage Max:5.5V; Digital IC Case Style:LQFP; No. of Pins:176; Program Memory Size:1MB; ;RoHS Compliant: Yes |
发布紧急采购，3分钟左右您将得到回复。