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参数资料
| 型号： | MBNC7-J-P-HN-ST-TH1 |
| 厂商： | SAMTEC INC |
| 元件分类： | RF连接器 |
| 英文描述： | BOARD TERMINATED, FEMALE, BNC CONNECTOR, SOLDER, JACK |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/2页 |
| 文件大小： | 242K |
| 代理商： | MBNC7-J-P-HN-ST-TH1 |
DESIGNED & DIMENSIONED
IN MILLIMETERS[INCHES]
THIS PRODUCT MANUFACTURED
WITH LEAD-FREE PROCESSING
Pb
DO NOT
SCALE FROM
THIS PRINT
1.27 .050
1.52 .060
(3 PLCS)
5.02 .198
2.51 .099
RECOMMENDED PCB HOLE LAYOUT
3.99
REF
.157
7.82
REF
.308
15.44
REF
.608
0.97
REF
.038
0.38
REF
.015
7.49 .295
'B'
9.04
REF
.356
R4.07
REF
.160
45° REF
90° REF
'D'
FIG.1
MBNC7-J-P-XX-ST-TH1 SHOWN
-HN: HEAVY GOLD/NICKEL (SEE NOTES 7 & 8)
(MBNC7-J-P-N-ST-TH1-BDY)
(MBNC7-J-P-ST-TH1-INS)
(MBNC7-J-P-H-ST-TH1-SKT)
-MN: MEDIUM GOLD/NICKEL (SEE NOTES 7 & 8)
(MBNC7-J-P-N-ST-TH1-BDY)
(MBNC7-J-P-ST-TH1-INS)
(MBNC7-J-P-M-ST-TH1-SKT)
MBNC7-J-P-XX-ST-TH1
GENDER
-J: JACK
-P: PCB
PLATING SPECIFICATION
TERMINATION
-TH1: THROUGH HOLE
ORIENTATION
-ST: STRAIGHT
TYPE
90°
0.57±0.03 .023±.001
(2 PLCS)
DETAIL 'B'
SCALE 16 : 1
C
4.10±0.10 .161±.004
(TO CENTER CONTACT)
C
'A'
MBNC7-J-P-X-ST-TH1-BDY
MBNC7-J-P-X-ST-TH1-SKT
MBNC7-J-P-ST-TH1-INS
C
DETAIL 'A'
SCALE 8 : 1
POSITION INSULATOR+0.10[.004] OUTSIDE
TO -0.10[.004] INSIDE BODY
R4.52
REF
.178
1.02
REF
.040
(3PLCS)
2.00
REF
.079
(2PLCS)
R3.10
REF
.122
DETAIL 'D'
SCALE 6 : 1
C
SHEET OF
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS [INCHES]
TOLERANCES ARE:
DECIMALS
ANGLES
.X: 0.3 [.01]
2
.XX: 0.13 [.005]
.XXX: 0.051 [.0020]
MATERIAL:
TRUE 75 OHM MINI BNC STRAIGHT JACK FOR PCB
BY:
MBNC7-J-P-XX-ST-TH1
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
J. BROWNING 11/16/2009
2
1
SHEET SCALE: 2:1
F:\DWG\MISC\MKTG\MBNC7-J-P-XX-ST-TH1-MKT.SLDDRW
NOTES:
1.
REPRESENTS A CRITICAL DIMENSION.
2. PUSHOUT FORCE FOR CENTER CONTACT: 26.69 N [6.00 LB] MIN.
FOR INSULATOR: 53.38 N [12.00 LB] MIN.
3. NOTE DELETED.
4. PRODUCT TO BE PACKAGED PER PACKAGING STANDARD CO-HD-WI-3040-M.
USE SAMTEC TRAY TY-SMA001-1 AND TY-SMA001-2. QUANTITIES LESS THAN A
FULL TRAY WILL NOT BE PACKAGED IN TRAYS.
5. RoHs COMPLIANT.
6. ALL PLATING MUST PASS SOLDERABILITY TEST PER MIL-STD-202G,
METHOD 208H USING TYPE "R" FLUX.
7. COMPONENT PLATING DESIGNATIONS:
-H: 0.000030" MIN. GOLD OVER 0.000050" MIN. NICKEL.
-M 0.000010" MIN. GOLD OVER 0.000050" MIN. NICKEL.
-N: 0.000100" MIN. NICKEL.
8. ASSEMBLY PLATING DESIGNATIONS:
-HN: (CENTER CONTACT)-H
(OUTER CONTACT) -N
(REMAINING METAL PARTS) -N
-MN: (CENTER CONTACT)-M
(OUTER CONTACT) -N
(REMAINING METAL PARTS) -N
BODY: BRASS
CONTACT: COPPER ALLOY
DIELECTRIC: PTFE
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
REVISION C
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