参数资料
型号: MBR745
厂商: ON Semiconductor
文件页数: 2/5页
文件大小: 115K
描述: DIODE SCHOTTKY 45V 7.5A TO220AC
产品变化通告: LTB Notification 03/Jan/2008
标准包装: 50
系列: SWITCHMODE™
二极管类型: 肖特基
电压 - (Vr)(最大): 45V
电流 - 平均整流 (Io): 7.5A
电压 - 在 If 时为正向 (Vf)(最大): 840mV @ 15A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 100µA @ 45V
安装类型: 通孔
封装/外壳: TO-220-2
供应商设备封装: TO-220-2
包装: 管件
其它名称: MBR745OS
MBR735, MBR745
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage MBR735
MBR745
V
V
RRM
RWM
VR
35
45
V
Average Rectified Forward Current
(TC
= 164
°C) Per Device
IF(AV)
7.5
A
Peak Repetitive Forward Current, (Square Wave, 20 kHz, TC
= 168
°C)
IFRM
7.5
A
Non?Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
150
A
Peak Repetitive Reverse Surge Current (2.0 s, 1.0 kHz)
IRRM
1.0
A
Storage Temperature Range
Tstg
?65 to +175
°C
Operating Junction Temperature (Note 1)
TJ
?65 to +175
°C
Voltage Rate of Change (Rated VR)
dv/dt
10,000
V/s
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
1. The heat generated must be less than the thermal conductivity from Junction?to?Ambient: dPD/dTJ
< 1/R
JA.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Maximum Thermal Resistance, Junction?to?Case
RJC
3.0
°C/W
Maximum Thermal Resistance, Junction?to?Ambient
RJA
60
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Maximum Instantaneous Forward Voltage (Note 2)
(iF
= 7.5 Amps, T
J
= 125
°C)
(iF
= 15 Amps, T
J
= 125
°C)
(iF
= 15 Amps, T
J
= 25
°C)
vF
?
?
?
0.48
0.61
0.68
0.57
0.72
0.84
V
Maximum Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, TJ
= 125
°C)
(Rated dc Voltage, TJ
= 25
°C)
iR
?
?
10
0.03
15
0.1
mA
2. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤
2.0%.
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