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参数资料
| 型号： | MBS324-636GG |
| 厂商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分类： | 插座 |
| 英文描述： | BGA324, IC SOCKET |
| 文件页数： | 1/1页 |
| 文件大小： | 46K |
| 代理商： | MBS324-636GG |
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
REV. 4/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).
3
Socket Features
Advanced exclusive eutectic solder
ball terminals offer superior SMT
processing.
Uses same footprint as BGA device.
Proven long-term performance in
vigorous temperature cycling applica-
tions – solder ball terminal absorbs
TCE mismatch.
Closed bottom socket terminal for
100% anti-wicking of solder.
Gold contacts allow gold/gold intercon-
nections to male Adapter pins.
Low insertion force socket with multi-
fingered high reliability Beryllium
Copper contacts.
Coplanarity consistently under .006 in.
(0.152mm) industry standard.
In-house Tape and Reel packaging
available.
Specifications
Terminals:
Brass; Copper Alloy (C36000),
ASTM-B-16
Contacts:
Beryllium Copper; Copper Alloy
(C17200), ASTM-B-194
Plating:
G – Gold over Nickel
Body Material:
M – Molded PPS (High Temp.
Glass Filled Thermoplastic), U.L.
Rated 94V-O, -60
°Cto 260°C (-76°F
to 500
°F)
F – FR-4 Glass Epoxy, U.L. Rated
94V-0
Solder Ball:
Eutectic, 63Sn/37Pb, 183
°C (361°F)
Footprint Dash#
If Applicable*
1
M
G
S
XXXX - 636 G
G
Contact Plating
G - Gold
Terminal Plating
G - Gold
Terminal Type
Body Type
M - Molded PPS (1.27 & 1.5mm pitch)
F - FR-4 (0.75, 0.80 & 1.0mm pitch)
Model Type
S = Standard Socket
SB = Extraction Socket [1.5, 1.27, and 1.0mm Pitch only]
SG = Guide Post Socket [1.5 and 1.27mm Pitch only]
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
Number of Positions
*See BGA Footprint Booklet
or web site
See options
Ball Grid Array
(BGA) Sockets
(Bottom view shown)
0.80mm Pitch Terminals
0.75mm Pitch Terminal
Type -702
Solder Ball
.020/(0.51) Dia.
.011 Dia.
(0.28)
.125
(3.18)
.080
(2.03)
Type -731
Thru-Hole
.125
(3.18)
PATENTED
How To Order – BGA Sockets
Standard Socket (S)
Mates with Standard Adapter (A)
Socket size: same size as BGA device body
Use with SMT Adapter for LGA and
reworked BGA device socketing (see pg. 7)
Extraction Socket (SB)
Mates with Extraction Slot Adapter (AX)
Socket size: BGA device body + .079/(2.0)
Protects valuable PCB during device/Adapter
extraction – tool never touches PCB
Available in 1.0, 1.27 and 1.5mm pitch only
Guide Post Socket (SG)
Integral molded corners allow accurate positioning
of device/Adapter assembly in blind-mating
applications
Mates with Extraction Slot Adapter (AX)
Socket size: BGA device body + .276/(7.00)
Now Available In
0.75mm Pitch
Type -716
Solder Ball
.024/(0.61) Dia.
.015 Dia.
(0.38)
.105
(2.67)
.125
(3.18)
Type -717
Thru-Hole
.105
(2.67)
.090
(2.29)
.090
(2.29)
PATENTED
Type -636
Solder Ball
STANDARD
.030/(0.76) Dia.
.117
(2.97)
.095
(2.41)
.018 Dia.
(0.46)
.117
(2.97)
.128
(3.25)
Type -673
Thru-Hole
PATENTED
1.27 & 1.5mm Pitch Terminals
1.0mm Pitch Terminals
Type -758
Solder Ball
.018/(0.46) Dia.
.125
(3.18)
PATENTED
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