- 您现在的位置：买卖IC网 > PDF目录11745 > MC100EP446FAR2G (ON Semiconductor)IC CONV 8BIT SER/PAR ECL 32LQFP PDF资料下载
参数资料
| 型号： | MC100EP446FAR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | IC CONV 8BIT SER/PAR ECL 32LQFP |
| 标准包装： | 2,000 |
| 应用： | 数据管理 |
| 接口： | 差分 |
| 电源电压： | 3 V ~ 5.5 V |
| 封装/外壳： | 32-LQFP |
| 供应商设备封装： | 32-LQFP（7x7） |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
| 其它名称： | MC100EP446FAR2GOS |
MC10EP446, MC100EP446
http://onsemi.com
19
PACKAGE DIMENSIONS
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
P
DETAIL Y
BASE
N
J
D
F
METAL
SECTION AEAE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250
(0.010)
GAUGE
PLANE
E
C
H
DETAIL AD
A1
B1
V1
4X
S
4X
9
T
Z
U
T-U
0.20 (0.008)
Z
AC
T-U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
AC
AB
M
_
8X
T
,
U
,
Z
T-U
M
0.20
(0.008)
Z
AC
32 LEAD LQFP
CASE 873A02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE
DETERMINED AT DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT
INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE
AB.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER
MAY VARY FROM DEPICTION.
DIM
A
MIN
MAX
MIN
MAX
INCHES
7.000 BSC
0.276 BSC
MILLIMETERS
B
7.000 BSC
0.276 BSC
C
1.400
1.600
0.055
0.063
D
0.300
0.450
0.012
0.018
E
1.350
1.450
0.053
0.057
F
0.300
0.400
0.012
0.016
G
0.800 BSC
0.031 BSC
H
0.050
0.150
0.002
0.006
J
0.090
0.200
0.004
0.008
K
0.450
0.750
0.018
0.030
M
12 REF
N
0.090
0.160
0.004
0.006
P
0.400 BSC
0.016 BSC
Q
1
5
1
5
R
0.150
0.250
0.006
0.010
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
__
_
B1
3.500 BSC
0.138 BSC
A1
3.500 BSC
0.138 BSC
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
相关PDF资料 |
PDF描述 |
|---|---|
| VE-B0X-IX-F4 | CONVERTER MOD DC/DC 5.2V 75W |
| V300A12E500BF3 | CONVERTER MOD DC/DC 12V 500W |
| PIC24HJ64GP502-E/SO | IC PIC MCU FLASH 64K 28-SOIC |
| PIC18F96J65-I/PT | IC PIC MCU FLASH 48KX16 100TQFP |
| ISL54101ACQZ | IC TMDS REGEN W/MUX 128-MQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC100EP446MNG | 功能描述:串行到并行逻辑转换器 ECL PARA T/SERIAL RoHS:否 制造商:Supertex 工作电源电压: 安装风格:SMD/SMT 封装 / 箱体:QFN-32 封装:Tray |
| MC100EP446MNR4G | 功能描述:串行到并行逻辑转换器 ECL PARA T/SERIAL RoHS:否 制造商:Supertex 工作电源电压: 安装风格:SMD/SMT 封装 / 箱体:QFN-32 封装:Tray |
| MC100EP451 | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:3.3V / 5VECL 6-Bit Differential Register with Master Reset |
| MC100EP451FA | 功能描述:触发器 3.3V/5V ECL 6-Bit RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
| MC100EP451FAG | 功能描述:触发器 3.3V/5V ECL 6-Bit Diff w/Master Reset RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。