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参数资料
| 型号： | MC100H606FN |
| 厂商： | MOTOROLA INC |
| 元件分类： | 通用总线功能 |
| 英文描述： | Registered Hex TTL/PECL Translator |
| 中文描述： | HEX TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PQCC28 |
| 封装： | PLASTIC, LCC-28 |
| 文件页数： | 4/5页 |
| 文件大小： | 89K |
| 代理商： | MC100H606FN |
MC10H606 MC100H606
MOTOROLA
MECL Data
DL122 — Rev 6
2–314
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
–N–
–M–
–L–
V
W
D
D
Y BRK
28
1
VIEW S
S
L–M
S
0.010 (0.250)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
0.004 (0.100)
SEATING
G1
G
J
C
Z
R
E
A
S
L–M
M
0.007 (0.180)
N
S
T
–T–
B
S
L–M
S
0.010 (0.250)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
U
S
L–M
M
0.007 (0.180)
N
S
T
Z
G1
X
VIEW D–D
S
L–M
M
0.007 (0.180)
N
S
T
K1
VIEW S
H
K
F
S
L–M
M
0.007 (0.180)
N
S
T
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
0.485
0.485
0.165
0.090
0.013
0.050 BSC
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
2
0.410
0.040
MAX
0.495
0.495
0.180
0.110
0.019
MIN
12.32
12.32
4.20
2.29
0.33
MAX
12.57
12.57
4.57
2.79
0.48
MILLIMETERS
INCHES
1.27 BSC
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
2
10.42
1.02
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.430
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
10.92
–––
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC100H606FNG | 功能描述:转换 - 电压电平 Registered Hex TTL to PECL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC100H607FN | 功能描述:转换 - 电压电平 Registered Hex RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC100H607FNG | 功能描述:转换 - 电压电平 Registered Hex PECL to TTL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC100H607FNR2 | 功能描述:转换 - 电压电平 Registered Hex RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC100H607FNR2G | 功能描述:转换 - 电压电平 Registered Hex PECL to TTL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
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