参数资料
型号: MC100LVE164FA
厂商: MOTOROLA INC
元件分类: 通用总线功能
英文描述: LOW VOLTAGE 16:1 MULTIPLEXER
中文描述: 100LVE SERIES, 16 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PQFP32
封装: 7 X 7 MM, 0.80 MM PITCH, PLASTIC, TQFP-32
文件页数: 3/4页
文件大小: 117K
代理商: MC100LVE164FA
MC100LVE164
4–3
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 — Rev 3
OUTLINE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 873A-02
ISSUE A
éé
METAL
éé
N
éé
éé
éé
éé
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
AE
P
DETAIL Y
D
F
SECTION AE–AE
G
SEATING
PLANE
R
Q
W
K
X
0
G
E
C
H
DETAIL AD
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5 DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9 EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
A1
MIN
7.000 BSC
3.500 BSC
MAX
MIN
0.276 BSC
0.138 BSC
MAX
INCHES
MILLIMETERS
B
B1
7.000 BSC
3.500 BSC
0.276 BSC
0.138 BSC
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
1.400
0.300
1.350
0.300
0.800 BSC
0.050
0.090
0.500
12 REF
0.090
0.400 BSC
1
0.150
9.000 BSC
4.500 BSC
1.600
0.450
1.450
0.400
0.055
0.012
0.053
0.012
0.031 BSC
0.002
0.004
0.020
12 REF
0.004
0.016 BSC
1
0.006
0.354 BSC
0.177 BSC
0.063
0.018
0.057
0.016
0.150
0.200
0.700
0.006
0.008
0.028
0.160
0.006
5
5
0.250
0.010
V
V1
W
X
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
DETAIL AD
A1
B1
V1
4X
S
4X
9
–T–
–Z–
–U–
T–U
0.20 (0.008)
Z
AC
T–U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
–AC–
–AB–
M
8X
T
M
0
Z
A
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