参数资料
| 型号： | MC10H116MELG |
| 厂商： | ON Semiconductor |
| 文件页数： | 6/6页 |
| 文件大小： | 0K |
| 描述： | IC LINE RCVR TRIPLE ECL 16SOEIAJ |
| 产品变化通告： | Product Obsolescence 05/Oct/2010 |
| 标准包装： | 1 |
| 系列： | 10H |
| 类型： | 线路接收器 |
| 驱动器/接收器数： | 0/3 |
| 电源电压： | 4.94 V ~ 5.46 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 16-SOEIAJ |
| 包装： | 剪切带 (CT) |
| 其它名称： | MC10H116MELGOSCT |
MC10H116
http://onsemi.com
6
PACKAGE DIMENSIONS
SO16
D SUFFIX
PLASTIC DIP PACKAGE
CASE 751B05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16
9
SEATING
PLANE
F
J
M
R X 45_
G
8 PL
P
B
A
M
0.25 (0.010)
B S
T
D
K
C
16 PL
S
B
M
0.25 (0.010)
A S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
__
SOEIAJ16
CASE 96601
ISSUE A
HE
A1
DIM
MIN
MAX
MIN
MAX
INCHES
2.05
0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.10
0.20
0.007
0.011
9.90
10.50
0.390
0.413
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
0.78
0.031
A1
HE
Q1
LE
_ 10_
0
_ 10_
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16
9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Phone: 81357733850
MC10H116/D
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