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参数资料
| 型号： | MC10H124FNR2 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 通用总线功能 |
| 英文描述： | Quad TTL-to-MECL Translator With TTL Strobe Input |
| 中文描述： | QUAD TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, PQCC20 |
| 封装： | PLASTIC, LCC-20 |
| 文件页数： | 3/4页 |
| 文件大小： | 102K |
| 代理商： | MC10H124FNR2 |
MC10H124
2–7
MOTOROLA
MECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
S
0.010 (0.250)
N
S
T
X
G1
B
U
Z
VIEW D–D
20
1
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
S
0.010 (0.250)
N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
H
VIEW S
K
K1
F
G1
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
0.385
0.385
0.165
0.090
0.013
0.050 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
2
0.310
0.040
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
1.27 BSC
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
7.88
1.02
MAX
10.03
10.03
4.57
2.79
0.48
MILLIMETERS
INCHES
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.330
–––
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
8.38
–––
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC10H124FNR2G | 功能描述:转换 - 电压电平 Quad TTL to ECL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC10H124L | 功能描述:转换 - 电压电平 Quad TTL to ECL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC10H124M | 功能描述:转换 - 电压电平 Quad TTL to ECL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC10H124MEL | 功能描述:转换 - 电压电平 Quad TTL to ECL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MC10H124MELG | 功能描述:转换 - 电压电平 Quad TTL to ECL RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
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