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参数资料
| 型号： | MC10H188P |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 门电路 |
| 英文描述： | Hex Buffer with Enable; Package: PDIP-16; No of Pins: 16; Container: Rail; Qty per Container: 25 |
| 中文描述： | 10H SERIES, HEX 1-INPUT NON-INVERT GATE, PDIP16 |
| 封装： | PLASTIC, DIP-16 |
| 文件页数： | 4/6页 |
| 文件大小： | 152K |
| 代理商： | MC10H188P |
MC10H188
http://onsemi.com
4
PACKAGE DIMENSIONS
M
N
L
Y BRK
W
V
D
S
LM
M
0.007 (0.180)
N S
T
S
LM
M
0.007 (0.180)
N S
T
S
LM
S
0.010 (0.250)
N S
T
X
G1
B
U
Z
VIEW DD
20
1
S
LM
M
0.007 (0.180)
N S
T
S
LM
M
0.007 (0.180)
N S
T
S
LM
S
0.010 (0.250)
N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T SEATING
PLANE
S
LM
M
0.007 (0.180)
N S
T
S
LM
M
0.007 (0.180)
N S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 77502
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM T, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.385
0.395
9.78
10.03
B
0.385
0.395
9.78
10.03
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
0.51
K
0.025
0.64
R
0.350
0.356
8.89
9.04
U
0.350
0.356
8.89
9.04
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
0.020
0.50
Z
2
10
2
10
G1
0.310
0.330
7.88
8.38
K1
0.040
1.02
__
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相关代理商/技术参数 |
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|---|---|
| MC10H188PD | 制造商:Motorola Inc 功能描述:Driver/Buffer Device, Single, 6-Bit, 16 Pin, Plastic, DIP |
| MC10H188PG | 功能描述:缓冲器和线路驱动器 Hex Buffer w/Enable RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| MC10H189FN | 功能描述:缓冲器和线路驱动器 Hex Inverter RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| MC10H189FNG | 功能描述:缓冲器和线路驱动器 Hex Inverter w/Enable RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| MC10H189FNR2 | 功能描述:缓冲器和线路驱动器 Hex Inverter RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
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