参数资料
| 型号： | MC14018BDG |
| 厂商： | ON Semiconductor |
| 文件页数： | 7/7页 |
| 文件大小： | 0K |
| 描述： | IC COUNTER DIV N PRESET 16SOIC |
| 标准包装： | 48 |
| 系列： | 4000B |
| 逻辑类型： | 除以 N |
| 元件数： | 1 |
| 每个元件的位元数： | 5 |
| 复位： | 异步 |
| 计时： | 同步 |
| 计数速率： | 8MHz |
| 触发器类型： | 正边沿 |
| 电源电压： | 3 V ~ 18 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
| 其它名称： | MC14018BDGOS |
MC14018B
http://onsemi.com
7
PACKAGE DIMENSIONS
SOIC16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16
9
SEATING
PLANE
F
J
M
R X 45_
G
8 PL
P
B
A
M
0.25 (0.010)
B S
T
D
K
C
16 PL
S
B
M
0.25 (0.010)
A S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X
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