参数资料
| 型号： | MC14067BDWR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 9/9页 |
| 文件大小： | 0K |
| 描述： | IC MUX/DEMUX 16X1 24SOIC |
| 产品变化通告： | Product Discontinuation 21/Jun/2007 |
| 标准包装： | 1 |
| 系列： | 4000B |
| 功能： | 多路复用器/多路分解器 |
| 电路： | 1 x 16:1 |
| 导通状态电阻： | 280 欧姆 |
| 电压电源： | 双电源 |
| 电压 - 电源，单路/双路(±)： | ±3 V ~ 18 V |
| 电流 - 电源： | 360nA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC |
| 包装： | 标准包装 |
| 其它名称： | MC14067BDWR2GOSDKR |
MC14067B
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC24 WB
CASE 751E04
ISSUE F
b
M
0.25
C
SEATING
PLANE
A1
M
L
DETAIL A
END VIEW
h
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND c APPLY TO THE FLAT SEC-
TION OF THE LEAD AND ARE MEASURED
BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
NOTE 3
PIN 1
12
1
24
13
TOP VIEW
DIM
MIN
MAX
MILLIMETERS
A
2.35
2.65
b
0.35
0.49
e
1.27 BSC
h
0.25
0.75
c
0.23
0.32
A1
0.13
0.29
L
0.41
0.90
M
0
8
_
D
E1
SIDE VIEW
11.00
24X
0.52
24X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
10.30 BSC
RECOMMENDED
INDICATOR
A
B
0.25 C
24X
B
A
C
A
NOTE 5
x 45
c
NOTE 3
DETAIL A
C
H
D
15.25
15.54
E1
7.40
7.60
E
S
e
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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MC14067B/D
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