参数资料
| 型号： | MC14536BFELG |
| 厂商： | ON Semiconductor |
| 文件页数： | 12/14页 |
| 文件大小： | 0K |
| 描述： | IC OSC PROG TIMER 2MHZ 16SOEIAJ |
| 标准包装： | 2,000 |
| 类型： | 可编程计时器 |
| 频率： | 2MHz |
| 电源电压： | 3 V ~ 18 V |
| 电流 - 电源： | 15µA |
| 工作温度： | -55°C ~ 125°C |
| 封装/外壳： | 16-SOIC（0.209"，5.30mm 宽） |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 16-SOEIAJ |
| 安装类型： | 表面贴装 |
MC14536B
http://onsemi.com
7
Figure 3. RC Oscillator Stability
Figure 4. RC Oscillator Frequency as a
Function of RTC and C
RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25°C
RS = 120 kW, f = 7.8 kHz @ VDD = 10 V, TA = 25°C
RTC = 56 kW,
C = 1000 pF
VDD = 15 V
10 V
5.0 V
8.0
4.0
0
-4.0
-8.0
-12
-16
-55
-25
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)*
*Device Only.
FREQUENCY
DEVIA
TION
(%)
TYPICAL RC OSCILLATOR CHARACTERISTICS
(For Circuit Diagram See Figure 13 In Application)
100
0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
1.0 k
10 k
100 k
1.0 M
0.0001
0.001
0.01
0.1
RTC, RESISTANCE (W)
C, CAPACITANCE (
mF)
f,OSCILLA
T
OR
FREQUENCY
(kHz)
f AS A FUNCTION
OF C
(RTC = 56 kW)
(RS = 120 k)
f AS A FUNCTION
OF RTC
(C = 1000 pF)
(RS ≈ 2RTC)
VDD = 10 V
Figure 5. Typical CX versus Pulse Width
@ VDD = 5.0 V
Figure 6. Typical CX versus Pulse Width
@ VDD = 10 V
100
0.1
1.0
10
1000
100
10
1.0
CX, EXTERNAL CAPACITANCE (pF)
,PULSE
WIDTH
(
t W
μ
s)
RX = 100 kW
50 k
W
10 k
W
5 k
W
TA = 25°C
VDD = 5 V
FORMULA FOR CALCULATING tW IN
MICROSECONDS IS AS FOLLOWS:
tW = 0.00247 RX (CX)0.85
WHERE R IS IN k
W, CX IN pF.
1000
100
10
1.0
CX, EXTERNAL CAPACITANCE (pF)
100
0.1
1.0
10
,PULSE
WIDTH
(
t W
μ
s)
FORMULA FOR CALCULATING tW IN
MICROSECONDS IS AS FOLLOWS:
tW = 0.00247 RX (CX)0.85
WHERE R IS IN k
W, CX IN pF.
RX = 100 kW
50 k
W
10 k
W
5 k
W
TA = 25°C
VDD = 10 V
Figure 7. Typical CX versus Pulse Width
@ VDD = 15 V
1000
100
10
1.0
CX, EXTERNAL CAPACITANCE (pF)
100
0.1
1.0
10
,PULSE
WIDTH
(
t W
μ
s)
FORMULA FOR CALCULATING tW IN
MICROSECONDS IS AS FOLLOWS:
tW = 0.00247 RX (CX)0.85
WHERE R IS IN k
W, CX IN pF.
RX = 100 kW
50 k
W
10 k
W
5 k
W
TA = 25°C
VDD = 15 V
MONOSTABLE CHARACTERISTICS
(For Circuit Diagram See Figure 12 In Application)
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