参数资料
型号: MC3302PG
厂商: ON Semiconductor
文件页数: 11/11页
文件大小: 0K
描述: IC COMP QUAD SINGLE SUPPLY 14DIP
标准包装: 500
类型: 通用
元件数: 4
输出类型: CMOS,开路集电极,TTL
电压 - 电源,单路/双路(±): 3 V ~ 30 V,±1.5 V ~ 15 V
电压 - 输入偏移(最小值): 20mV @ 5V
电流 - 输入偏压(最小值): 0.5µA @ 5V
电流 - 输出(标准): 16mA @ 5V
电流 - 静态(最大值): 2.5mA
工作温度: -40°C ~ 85°C
封装/外壳: 14-DIP(0.300",7.62mm)
安装类型: 通孔
包装: 管件
产品目录页面: 1130 (CN2011-ZH PDF)
其它名称: MC3302PGOS
LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
http://onsemi.com
9
PACKAGE DIMENSIONS
PDIP14
CASE 64606
ISSUE R
17
14
8
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010
CA
SIDE VIEW
M
14X
D1
e
A2
NOTE 3
M
B M
eB
E
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.735
0.775
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
18.67
19.69
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
c
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
NOTE 6
M
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