参数资料
型号: MC33071ADR2G
厂商: ON Semiconductor
文件页数: 19/26页
文件大小: 0K
描述: IC OPAMP SINGLE 4.5MHZ HS 8-SOIC
标准包装: 2,500
放大器类型: 通用
电路数: 1
转换速率: 13 V/µs
增益带宽积: 4.5MHz
电流 - 输入偏压: 100nA
电压 - 输入偏移: 500µV
电流 - 电源: 1.9mA
电流 - 输出 / 通道: 30mA
电压 - 电源,单路/双路(±): 3 V ~ 44 V,±1.5 V ~ 22 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A
http://onsemi.com
26
PACKAGE DIMENSIONS
WQFN10
CASE 510AJ
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C SEATING
PLANE
D
E
0.15 C
A3
A
A1
0.15 C
DIM
A
MIN
MAX
MILLIMETERS
0.70
0.80
A1
0.00
0.05
A3
0.20 REF
b
0.20
0.30
D
2.60 BSC
E
2.60 BSC
0.55
0.65
L2
e
0.50 BSC
PIN ONE
REFERENCE
0.08 C
0.10 C
A
0.10 C
L
e
b
B
4
10
10X
1
6
9X
0.05 C
0.45
0.55
L
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.90
0.73
0.50
0.30
10X
DIMENSIONS: MILLIMETERS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
B
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A
DETAIL B
DETAIL A
1
0.00
0.15
L1
9
5
L2
PITCH
10X
NOTE 3
NOTE 4
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