参数资料
型号: MC33074ADG
厂商: ON Semiconductor
文件页数: 15/26页
文件大小: 0K
描述: IC OPAMP QUAD 4.5MHZ 14SOIC
标准包装: 55
放大器类型: 通用
电路数: 4
转换速率: 13 V/µs
增益带宽积: 4.5MHz
电流 - 输入偏压: 100nA
电压 - 输入偏移: 500µV
电流 - 电源: 1.9mA
电流 - 输出 / 通道: 30mA
电压 - 电源,单路/双路(±): 3 V ~ 44 V,±1.5 V ~ 22 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
供应商设备封装: 14-SOICN
包装: 管件
产品目录页面: 1130 (CN2011-ZH PDF)
其它名称: MC33074ADGOS
MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A
http://onsemi.com
22
PACKAGE DIMENSIONS
8 LEAD PDIP
CASE 62605
ISSUE N
14
5
8
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010
CA
SIDE VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.355
0.400
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
9.02
10.16
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
E1
M
8X
c
D1
B
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
e
e/2
A2
NOTE 3
M
B M
NOTE 6
M
PDIP14
CASE 64606
ISSUE R
17
14
8
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010
CA
SIDE VIEW
M
14X
D1
e
A2
NOTE 3
M
B M
eB
E
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.735
0.775
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
18.67
19.69
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
c
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
NOTE 6
M
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