参数资料
型号: MC33163DWR2G
厂商: ON Semiconductor
文件页数: 6/16页
文件大小: 0K
描述: IC REG BUCK BOOST INV ADJ 16SOIC
标准包装: 1,000
类型: 降压(降压),升压(升压),反相
输出类型: 可调式
输出数: 1
输出电压: 1.25 V ~ 40 V
输入电压: 2.5 V ~ 40 V
PWM 型: 电压模式
频率 - 开关: 50kHz
电流 - 输出: 3.4A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
包装: 带卷 (TR)
供应商设备封装: 16-SOIC W
其它名称: MC33163DWR2GOS
MC33163DWR2GOS-ND
MC33163DWR2GOSTR
MC34163, MC33163
8.0
7.2
V CC = 15 V
Pins 7, 8, 16 = V CC
6.0
4.0
6.4
5.6
Pins 4, 6, 14 = GND
Remaining Pins Open
2.0
Pins 7, 8, 16 = V CC
Pins 4, 6, 14 = GND
Remaining Pins Open
T A = 25 ° C
4.8
0
0
10
20 30
40
4.0
- 55
- 25
0 25 50 75
100
125
V CC , SUPPLY VOLTAGE (V)
Figure 14. Standby Supply Current
versus Supply Voltage
T A , AMBIENT TEMPERATURE ( ° C)
Figure 15. Standby Supply Current
versus Temperature
3.0
C T = 620 pF
100
Printed circuit board heatsink example
5.0
Pins 7,8 = V CC
2.6
2.2
Pin 16 Open
Pins 4, 14 = GND
Pin 9 = 1.0 k W to 15 V
Pin 10 = 100 W to 15 V
80
60
R q JA
2.0 oz
L
Copper
L 3.0 mm
Graphs represent symmetrical layout
4.0
3.0
1.8
Pin 16 = V CC
40
2.0
1.4
20
P D(max) for T A = 70 ° C
1.0
1.0
- 55
- 25
0
25
50
75
100
125
0
0
10
20
30
40
0
50
T A , AMBIENT TEMPERATURE ( ° C)
Figure 16. Minimum Operating Supply
Voltage versus Temperature
100
L, LENGTH OF COPPER (mm)
Figure 17. P Suffix (DIP ? 16) Thermal Resistance
and Maximum Power Dissipation
versus P.C.B. Copper Length
2.8
90
80
P D(max) for T A = 50 ° C
Graph represents symmetrical layout
2.4
2.0
70
60
L
2.0 oz.
Copper
1.6
1.2
50
40
30
R q JA
L
3.0 mm
0.8
0.4
0
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 18. DW Suffix (SOP ? 16L) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
http://onsemi.com
6
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