参数资料
型号: MC33163PG
厂商: ON Semiconductor
文件页数: 2/16页
文件大小: 0K
描述: IC REG BUCK BOOST INV ADJ 16DIP
标准包装: 25
类型: 降压(降压),升压(升压),反相
输出类型: 可调式
输出数: 1
输出电压: 1.25 V ~ 40 V
输入电压: 2.5 V ~ 40 V
PWM 型: 电压模式
频率 - 开关: 50kHz
电流 - 输出: 3.4A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 16-DIP(0.300",7.62mm)
包装: 管件
供应商设备封装: 16-PDIP
其它名称: MC33163PGOS
MC34163, MC33163
MAXIMUM RATINGS (Note 1)
Rating
Power Supply Voltage
Switch Collector Voltage Range
Switch Emitter Voltage Range
Switch Collector to Emitter Voltage
Switch Current (Note 2)
Driver Collector Voltage
Driver Collector Current
Bootstrap Input Current Range (Note 2)
Current Sense Input Voltage Range
Feedback and Timing Capacitor Input Voltage Range
Low Voltage Indicator Output Voltage Range
Low Voltage Indicator Output Sink Current
Thermal Characteristics
P Suffix, Dual ? In ? Line Case 648C
Thermal Resistance, Junction ? to ? Air
Thermal Resistance, Junction ? to ? Case (Pins 4, 5, 12, 13)
DW Suffix, Surface Mount Case 751G
Thermal Resistance, Junction ? to ? Air
Thermal Resistance, Junction ? to ? Case (Pins 4, 5, 12, 13)
Operating Junction Temperature
Operating Ambient Temperature (Note 3)
MC34163
MC33163
Storage Temperature Range
Symbol
V CC
V C(switch)
V E(switch)
V CE(switch)
I SW
V C(driver)
I C(driver)
I BS
V Ipk (Sense)
V in
V C(LVI)
I C(LVI)
R q JA
R q JC
R q JA
R q JC
T J
T A
T stg
Value
40
? 1.0 to + 40
? 2.0 to V C(switch)
40
3.4
? 1.0 to +40
150
? 100 to +100
(V CC ? 7.0) to (V CC +1.0)
? 1.0 to + 7.0
? 1.0 to + 40
10
80
15
94
18
+150
0 to +70
? 40 to + 85
? 65 to +150
Unit
V
V
V
V
A
V
mA
mA
V
V
V
mA
° C/W
° C
° C
° C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests: Human Body Model 1500 V per MIL ? STD ? 883, Method 3015.
Machine Model Method 150 V.
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
ORDERING INFORMATION
MC33163DW
MC33163DWG
MC33163DWR2
MC33163DWR2G
MC33163P
MC33163PG
MC34163DW
MC34163DWG
MC34163DWR2
MC34163DWR2G
MC34163P
MC34163PG
Device
Package
SOIC ? 16W
SOIC ? 16W
(Pb ? Free)
SOIC ? 16W
SOIC ? 16W
(Pb ? Free)
PDIP ? 16
PDIP ? 16
(Pb ? Free)
SOIC ? 16W
SOIC ? 16W
(Pb ? Free)
SOIC ? 16W
SOIC ? 16W
(Pb ? Free)
PDIP ? 16
PDIP ? 16
(Pb ? Free)
Shipping ?
47 Units / Rail
47 Units / Rail
1000 Units / Reel
1000 Units / Reel
25 Units / Rail
25 Units / Rail
47 Units / Rail
47 Units / Rail
1000 Units / Reel
1000 Units / Reel
25 Units / Rail
25 Units / Rail
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
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