参数资料
| 型号： | MC33275ST-3.3T3G |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/14页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .3A SOT223 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 13V |
| 电压 - 压降（标准）： | 0.26V @ 300mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 300mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-4，TO-261AA |
| 供应商设备封装： | SOT-223 |
| 包装： | 标准包装 |
| 其它名称： | MC33275ST-3.3T3GOSDKR |
MC33275, NCV33275
PIN CONNECTIONS
GND
GND
GND
GND
N/C
N/C
1
4
2 3
V in GND V out
4
1 2 3
V in GND V out
1 8
Input Output
2 7
3 6
GND GND
4 5
Pins 4 and 5 Not Connected
Input
Input
Input
N/C
1
2
3
4
8
7
6
5
Output
N/C
GND
N/C
MC33275ST
MC33275DT
MC33275D
MC33275MN
MAXIMUM RATINGS
Rating
Input Voltage
Power Dissipation and Thermal Characteristics
T A = 25 ° C
Maximum Power Dissipation
Case 751 (SOIC ? 8) D Suffix
Thermal Resistance, Junction ? to ? Ambient
Thermal Resistance, Junction ? to ? Case
Case 318E (SOT ? 223) ST Suffix
Thermal Resistance, Junction ? to ? Air
Thermal Resistance, Junction ? to ? Case
Case 369A (DPAK ? 3) DT Suffix
Thermal Resistance, Junction ? to ? Air
Thermal Resistance, Junction ? to ? Case
Case 488AF (DFN ? 8, 4x4) MN Suffix
Thermal Resistance, Junction ? to ? Air (with 1.0 oz PCB cu area)
Thermal Resistance, Junction ? to ? Air (with 1.8 oz PCB cu area)
Thermal Resistance, Junction ? to ? Case
Output Current
Maximum Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
Symbol
V CC
P D
R q JA
R q JC
R q JA
R q JC
R q JA
R q JC
R q JA
R q JA
psi ? JC*
I O
T J
T A
T stg
ESD
Value
13
Internally Limited
160
25
245
15
92
6.0
183
93
9.0
300
150
? 40 to +125
? 65 to +150
4000
400
Unit
Vdc
W
° C/W
° C/W
° C/W
° C/W
° C/W
° C/W
° C/W
° C/W
° C/W
mA
° C
° C
° C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*“C’’ (“case’’) is defined as the solder ? attach interface between the center of the exposed pad on the bottom of the package, and the board to
which it is attached.
http://onsemi.com
2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC33275ST-5.0T3 | 功能描述:低压差稳压器 - LDO 5.0V 300mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MC33275ST-5.0T3G | 功能描述:低压差稳压器 - LDO 5.0V 300mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MC33275ST-5.0T3G | 制造商:ON Semiconductor 功能描述:Linear Voltage Regulator IC |
| MC33276 | 制造商:SPC Multicomp 功能描述:HEATSINK TO218/220 7/W CLIP/HOLE 制造商:SPC Multicomp 功能描述:HEATSINK TO218/220 7C/W CLIP/HOLE 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-218 / TO-220 / TO-247; Thermal Resistance:7C/W; External Height - Imperial:1.378"; External Height - Metric:35mm; External Width - Imperial:2.008"; External Width - Metric:51mm; Height:35mm; Width:51mm ;RoHS Compliant: Yes |
| MC33277 | 制造商:SPC Multicomp 功能描述:HEATSINK TO220 28/W 制造商:SPC Multicomp 功能描述:HEATSINK TO220 28C/W 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-220; Thermal Resistance:28C/W; External Height - Imperial:0.787"; External Height - Metric:20mm; External Width - Imperial:0.776"; External Width - Metric:19.7mm; External Length - Imperial:0.319" ;RoHS Compliant: Yes |
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