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参数资料
型号： MC33394DH
厂商： Freescale Semiconductor
文件页数： 36/44页
文件大小： 0K
描述： IC POWER SUPPLY MULT-OUT 44-HSOP
标准包装： 30
应用： Motorola MPC55x、MPC56x 微处理器
接口： SPI 串行
电源电压： 4 V ~ 26.5 V
封装/外壳： 44-BSSOP（0.433"，11.00mm 宽）裸露焊盘
供应商设备封装： 44-HSOP
包装： 管件
安装类型： 表面贴装
33394
41
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PACKAGE DIMENSIONS
DWB SUFFIX
54–LEAD SOICW–EP
PLASTIC PACKAGE
CASE 1377–01
ISSUE B
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS B AND C TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS SHALL
NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED 0.46 MM. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD SHALL NOT LESS THAN
0.07 MM.
7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8. THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.1 MM AND
0.3 MM FROM THE LEAD TIP.
9. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTER–LEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF
THE PLASTIC BODY.
CL
17.8
7.4
1
27
28
54
0.10
A
2.35
SEATING
PLANE
0.9
SECTION B–B
0.65
R0.08 MIN
B
A
(0.29)
0.38
0.30
(0.25)
PLATING
BASE METAL
SECTION A–A
ROTATED 90 CLOCKWISE
_
8
0.25
0.22
9
5
0.13 M
C
AB
6
A
C
7.6
18.0
9
4
10.3
5.15
A
54X
52X
2.65
0.3
A
2X 27 TIPS
B
C
BB
0.1
0.0
0.5
0°
8°
0°
0.25
GAUGE PLANE
MIN
PIN 1 INDEX
C
(1.43)
6.6
5.9
0.30
C
AB
4.8
4.3
0.30
C
AB
VIEW C–C
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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MC33395DWB 功能描述:马达/运动/点火控制器和驱动器 TPD RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube
MC33395DWBR2 功能描述:马达/运动/点火控制器和驱动器 TPD RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube
MC33395EW 功能描述:马达/运动/点火控制器和驱动器 TPD - THREE PHASE DRIVER RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube
MC33395EWR2 功能描述:马达/运动/点火控制器和驱动器 TPD - THREE PHASE DRIVER RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube
MC33395TDWB 功能描述:马达/运动/点火控制器和驱动器 TPDT RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube
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