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参数资料
| 型号： | MC33399D |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 14/19页 |
| 文件大小： | 0K |
| 描述： | IC LIN INTERFACE W/WAKE 8-SOIC |
| 标准包装： | 98 |
| 系列： | * |
| 应用： | * |
| 接口： | * |
| 电源电压： | * |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 管件 |
| 安装类型： | 表面贴装 |
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33399
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Continuous Supply Voltage
Transient Voltage (Load Dump)
VSUP
27
40
V
WAKE DC and Transient Voltage (Through a 33 k
Serial Resistor)
VWAKE
-18 to 40
V
Logic Voltage (RXD, TXD, EN Pins)
VLOG
-0.3 to 5.5
V
LIN Pin
DC Voltage
Transient (Coupled Through 1.0 nF Capacitor)
VBUS
-18 to 40
-150 to 100
V
INH Voltage/Current
DC Voltage
VINH
-0.3 to VSUP + 0.3
V
ESD Voltage, Human Body Model (1)
All Pins
LIN Bus Pin with Respect to Ground
VESD1
±4000
±5000
V
ESD Voltage, Machine Model
All Pins
VESD2
±200
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
TA
TJ
-40 to 125
-40 to 150
C
Storage Temperature
TSTG
-55 to 150
C
Thermal Resistance, Junction to Ambient
RJA
150
C/W
Peak Package Reflow Temperature During Reflow (2), (3)
TPPRT
°C
Thermal Shutdown
TSHUT
150 to 200
C
Thermal Shutdown Hysteresis
THYST
8.0 to 20
C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 220 pF, RZAP = 0 ).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3.
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相关代理商/技术参数 |
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