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参数资料
| 型号： | MC33794DH/R2 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 模拟信号调理 |
| 英文描述： | Electric Field Imaging Device |
| 中文描述： | SPECIALTY ANALOG CIRCUIT, PDSO44 |
| 封装： | PLASTIC, HSOP-44 |
| 文件页数： | 23/23页 |
| 文件大小： | 574K |
| 代理商： | MC33794DH/R2 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33794
9
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 85
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Resistance
Junction-to-Ambient (Note 3)
Junction-to-Case (Note 4)
Junction-to-Board (Note 5)
RθJ-A
RθJ-C
RθJ-B
41
0.2
3.0
°C/W
Soldering Temperature (for 10 Seconds)
TSOLDER
260
°C
Notes
1.
ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
2.
ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
3.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-87
and JEDEC JESD51-2 with the single layer board horizontal.
4.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883
Method 1012.1) with the cold plate temperature used for the case temperature.
5.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
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| MC33794DWB | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 传感器和探测器接口 系列:- 其它有关文件:Automotive Product Guide 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:74 系列:- 类型:触控式传感器 输入类型:数字 输出类型:数字 接口:JTAG，串行 电流 - 电源:100µA 安装类型:表面贴装 封装/外壳:20-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:20-TSSOP 包装:管件 |
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