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| 型号： | MC33880DWBR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/25页 |
| 文件大小： | 0K |
| 描述： | IC SERIAL SWITCH OCT WSPI 32SOIC |
| 标准包装： | 1 |
| 类型： | 高端/低端驱动器 |
| 输入类型： | SPI |
| 输出数： | 8 |
| 导通状态电阻： | 550 毫欧 |
| 电流 - 峰值输出： | 1.4A |
| 电源电压： | 5.5 V ~ 24.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 32-SOIC |
| 包装： | 剪切带 (CT) |
| 配用： | KIT33880DWBEVB-ND - KIT EVAL FOR MC33880 8X SW W/SPI |
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD Supply Voltage
V DD
-0.3 to 7.0
V DC
CS, DI, DO, SCLK, IN5, IN6, and EN (1)
VPWR Supply Voltage (1)
Drain 1 – 8 (2)
5.0 mA ≤ I OUT ≤ 0.3 A
Source 1 – 8 (3)
5.0 mA ≤ I OUT ≤ 0.3 A
Output Voltage Clamp Low-Side Drive (4)
Output Voltage Clamp High-Side Drive (4)
Output Clamp Energy (5)
ESD Voltage (6)
Human Body Model
Machine Model
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Maximum Junction Temperature
–
V PWR
–
–
V OC
V OC
E CLAMP
V ESD1
V ESD2
T STG
T C
T J
–
-0.3 to 7.0
-16 to 50
-18 to 40
-28 to 40
40 to 55
-15 to -25
50
±2000
±200
-55 to 150
-40 to 125
-40 to 150
-40 to 150
V DC
V DC
V DC
V DC
V DC
V DC
mJ
V
° C
° C
° C
° C
Power Dissipation (T A = 25 ° C)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
P D
1.3
1.7
W
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
Peak Package Reflow Temperature During Reflow (8) , (9)
R θ JA
R θ JA
R θ JL
T PPRT
94
70
18
° C/W
° C/W
°C
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150 ° C junction temperature using single non-repetitive pulse method.
ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 Ω ), and ESD2 testing is performed
in accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 Ω ).
Maximum power dissipation with no heatsink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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