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| 型号： | MC33912G5ACR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 8/95页 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM BASIS CHIP 32LQFP |
| 标准包装： | 2,000 |
| 应用： | 系统基础芯片 |
| 电流 - 电源： | 4.5mA |
| 电源电压： | 5.5 V ~ 27 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-LQFP |
| 供应商设备封装： | 32-LQFP（7x7） |
| 包装： | 带卷 (TR) |
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MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
ESD Capability
Ratings
Symbol
Value
Unit
V
AECQ100
Human Body Model - JESD22/A114 (C ZAP = 100 pF, R ZAP = 1500 ? )
LIN Pin
L1, L2, L3, and L4
all other Pins
Charge Device Model - JESD22/C101 (C ZAP = 4.0 pF ??
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (C ZAP = 150 pF, R ZAP = 330 ? )
Contact Discharge, Unpowered
LIN pin with 220 pF
LIN pin without capacitor
VS1/VS2 (100 nF to ground)
Lx inputs (33 k ? serial resistor)
According to IEC 61000-4-2 (C ZAP = 150 pF, R ZAP = 330 ? )
Unpowered
LIN pin with 220 pF and without capacitor
VS1/VS2 (100 nF to ground)
Lx inputs (33 k ? serial resistor)
THERMAL RATINGS
V ESD1-1
V ESD1-2
V ESD1-3
V ESD2-1
V ESD2-2
V ESD3-1
V ESD3-2
V ESD3-3
V ESD3-4
V ESD4-1
V ESD4-2
V ESD4-3
± 8.0k
± 6.0k
±2000
± 750
± 500
± 20k
± 11k
>± 12k
±6000
± 8000
± 8000
± 8000
Operating Ambient Temperature (9)
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction to Ambient
Natural Convection, Single Layer board (1s) (9), (10)
Natural Convection, Four Layer board (2s2p) (9), (11)
Thermal Resistance, Junction to Case (12)
Peak Package Reflow Temperature During Reflow (13), (14)
33912
34912
T A
T J
T STG
R ? JA
R ? JC
T PPRT
-40 to 125
-40 to 85
-40 to 150
-55 to 150
85
56
23
? C
? C
? C
? C/W
? C/W
°C
Notes
9.
10.
11.
12.
13.
14.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
33912
Analog Integrated Circuit Device Data ?
8
Freescale Semiconductor
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