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参数资料
| 型号： | MC33996EKR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH 16-OTPT W/SPI 32-SOIC |
| 标准包装： | 1,000 |
| 类型： | 低端 |
| 输入类型： | SPI |
| 输出数： | 16 |
| 导通状态电阻： | 550 毫欧 |
| 电流 - 峰值输出： | 1.2A |
| 电源电压： | 5 V ~ 27 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-BSOP（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 32-SOICW 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 配用： | KIT33996EKEVB-ND - KIT EVAL 33996 16OUTPUT SW W/SPI |
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33996 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33996 is offered in a 32 pin SOICW exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T J ), and thermal
resistance (R θ JA ).
33996EK
32-PIN
SOICW-EP
T J
=
R θ JA
.
P
EK (PB-FREE) SUFFIX
98ARL10543D
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant
to and will not predict the performance of a package in an application-specific
environment. Stated values were obtained by measurement and simulation
according to the standards listed below.
Standards
Table 7. Thermal Performance Comparisons
32-PIN SOICW-EP
Note For package dimensions, refer to
the 33996 data sheet.
R θ JA
Thermal Resistance
[ ° C/W]
29
*All Measurements
are in Millimeters
1.0
R θ JB
9.0
1.0
R θ JA (1) , (4)
R θ JC (5)
69
2.0
0.2
0.2
Notes:
1. Per JEDEC JESD51-2 at natural convection, still air
condition.
2. 2s2p thermal test board per JEDEC JESD51-5 and
JESD51-7.
3. Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4. Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5. Thermal resistance between the die junction and the
exposed pad surface; cold plate attached to the package
bottom side, remaining surfaces insulated.
32 Pin SOICW-EP
0.65 Pitch
11.0 mm x 7.5mm Body
4.6 mm x 5.7 mm Exposed Pad
Figure 14. Surface Mount for SOICW Exposed Pad
33996
Analog Integrated Circuit Device Data
20
Freescale Semiconductor
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相关代理商/技术参数 |
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|---|---|
| MC33997DW | 功能描述:IC SWITCH 3.3/5V SUPPLY 24-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| MC33997DWR2 | 制造商:Rochester Electronics LLC 功能描述:MLPS 3.3 IC - Bulk |
| MC33999EK | 功能描述:多路器开关 IC 16 LOW SIDE PWM&SPI RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| MC33999EK | 制造商:Freescale Semiconductor 功能描述:IC SWITCH 16 OUT SPI/PWM 54SOIC |
| MC33999EKR2 | 功能描述:多路器开关 IC 16 LOW SIDE PWM&SPI RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
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