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| 型号： | MC33997DW |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/20页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH 3.3/5V SUPPLY 24-SOIC |
| 标准包装： | 30 |
| 应用： | 切换电源，微处理器 |
| 输入电压： | 6 V ~ 26.5 V |
| 输出数： | 5 |
| 输出电压： | 3.3V，5V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC W |
| 包装： | 管件 |
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Main Supply Voltage
Keep-Alive Supply Voltage
Switching Node
5.0 V Input Power
Sensor Supply
Keep-Alive Supply Voltage
Maximum Voltage at Logic I/O Pins
Charge Pump Reservoir Capacitor Voltage
Error Amplifier Summing Node
Switching Regulator Output Feedback
VDDL Base Drive
VDDL Feedback
ESD Voltage
Symbol
V PWR
KA_V PWR
V SW
V DDH
V REF1
V REF2
V KAM
EN
SNSEN
PWROK
VKAMOK
C RES
V SUM
FBKB
DRVL
FBL
Value
-0.3 to 45
-0.3 to 45
-0.5 to 45
-0.3 to 6.0
-0.3 to 18
-0.3 to 18
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 18
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
Human Body Model (all pins)
Machine Model (all pins) (1)
V ESD1
V ESD2
±500
±100
Power Dissipation (T A = 25 ° C) (2)
Thermal Resistance, Junction to Ambient (3) , (4)
Thermal Resistance, Junction to Board (5)
P D
R θ JA
R θ JB
800
60
20
mW
°C/W
°C/W
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 ? ). ESD2 testing is performed in
accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 ? )
2.
3.
4.
5.
Maximum power dissipation at indicated junction temperature.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
33997
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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| MC3399DW | 制造商: 功能描述: 制造商:undefined 功能描述: |
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