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参数资料
| 型号： | MC33998 |
| 厂商： | 飞思卡尔半导体(中国)有限公司 |
| 元件分类： | 基准电压源/电流源 |
| 英文描述： | Switching Power Supply with Linear Regulators(带线性稳压器的开关电源) |
| 中文描述： | 开关电源与线性稳压器（带线性稳压器的开关电源） |
| 文件页数： | 5/20页 |
| 文件大小： | 437K |
| 代理商： | MC33998 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33998
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Main Supply Voltage
V
PWR
-0.3 to 45
V
Keep-Alive Supply Voltage
KA_V
PWR
-0.3 to 45
V
Switching Node
V
SW
-0.5 to 45
V
5.0 V Input Power
V
DDH
-0.3 to 6.0
V
Sensor Supply
V
REF1
V
REF2
-0.3 to 18
-0.3 to 18
V
Keep-Alive Supply Voltage
V
KAM
-0.3 to 6.0
V
Maximum Voltage at Logic I/O Pins
EN
SNSEN
PWROK
VKAMOK
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
V
Charge Pump Reservoir Capacitor Voltage
C
RES
-0.3 to 18
V
Error Amplifier Summing Node
V
SUM
-0.3 to 6.0
V
Switching Regulator Output Feedback
FBKB
-0.3 to 6.0
V
V
DDL
Base Drive
DRVL
-0.3 to 6.0
V
V
DDL
Feedback
FBL
-0.3 to 6.0
V
ESD Voltage
Human Body Model (all pins) (Note 1)
Machine Model (all pins) (Note 2)
V
ESD1
V
ESD2
±500
±100
V
Power Dissipation (T
A
= 25
°
C) (Note 3)
P
D
800
mW
Thermal Resistance, Junction to Ambient (Note 4), (Note 5)
R
θ
J-A
60
°C/W
Thermal Resistance, Junction to Board (Note 6)
R
θ
J-B
20
°C/W
Operational Package Temperature [Ambient Temperature] (Note 7)
T
A
-40 to 125
°C
Operational Junction Temperature
T
J
-40 to 150
°C
Storage Temperature
T
STG
-55 to 150
°C
Lead Soldering Temperature (Note 8)
T
S
260
°C
Notes
1.
2.
3.
4.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
)
Maximum power dissipation at indicated junction temperature.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
6.
7.
8.
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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