参数资料
型号: MC34063AP1
厂商: ON Semiconductor
文件页数: 13/15页
文件大小: 0K
描述: IC REG BUCK BOOST INV ADJ 8DIP
产品变化通告: LTB Notification 06/Feb/2008
标准包装: 50
类型: 降压(降压),升压(升压),反相
输出类型: 可调式
输出数: 1
输出电压: 1.25 V ~ 40 V
输入电压: 3 V ~ 40 V
频率 - 开关: 100kHz
电流 - 输出: 1.5A
同步整流器:
工作温度: 0°C ~ 70°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
包装: 管件
供应商设备封装: 8-PDIP
其它名称: MC34063AP1OS
MC34063A, MC33063A, SC34063A, SC33063A, NCV33063A
PACKAGE DIMENSIONS
? Y ?
B
? X ?
8
1
A
5
4
S
0.25 (0.010)
M
Y
M
SOIC ? 8 NB
CASE 751 ? 07
ISSUE AJ
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751 ? 01 THRU 751 ? 06 ARE OBSOLETE. NEW
STANDARD IS 751 ? 07.
? Z ?
H
G
D
C
SEATING
PLANE
0.10 (0.004)
N
X 45 _
M
J
DIM
A
B
C
D
G
H
J
K
M
N
MILLIMETERS
MIN MAX
4.80 5.00
3.80 4.00
1.35 1.75
0.33 0.51
1.27 BSC
0.10 0.25
0.19 0.25
0.40 1.27
0 _ 8 _
0.25 0.50
INCHES
MIN MAX
0.189 0.197
0.150 0.157
0.053 0.069
0.013 0.020
0.050 BSC
0.004 0.010
0.007 0.010
0.016 0.050
0 _ 8 _
0.010 0.020
0.25 (0.010)
M
Z Y
S
X
S
S
5.80 6.20
0.228 0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
0.6
0.024
4.0
0.155
1.270
0.050
SCALE 6:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
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