参数资料
| 型号： | MC34268DTRKG |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 800MA 2.85V DPAK-3 |
| 产品变化通告： | Product Discontinuation 03/Oct/2007 |
| 标准包装： | 2,500 |
| 应用： | 转换器，SCSI-2 |
| 输入电压： | 15V |
| 输出数： | 1 |
| 输出电压： | 2.85V |
| 工作温度： | 0°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-252-3，DPak（2 引线+接片），SC-63 |
| 供应商设备封装： | DPAK-3 |
| 包装： | 带卷 (TR) |
| 其它名称： | MC34268DTRKGOS |
MC34268
PACKAGE DIMENSIONS
SOIC ? 8
D SUFFIX
CASE 751 ? 07
ISSUE AB
NOTES:
? X ?
8
A
5
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
? Y ?
B
1
4
S
0.25 (0.010)
M
Y
M
K
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. 751?01 THRU 751?06 ARE OBSOLETE. NEW
STANDARD IS 751?07.
? Z ?
H
G
D
0.25 (0.010)
M
Z Y
C
S
X
SEATING
PLANE
0.10 (0.004)
S
N
X 45 _
M
J
DIM
A
B
C
D
G
H
J
K
M
N
S
MILLIMETERS
MIN MAX
4.80 5.00
3.80 4.00
1.35 1.75
0.33 0.51
1.27 BSC
0.10 0.25
0.19 0.25
0.40 1.27
0 _ 8 _
0.25 0.50
5.80 6.20
INCHES
MIN MAX
0.189 0.197
0.150 0.157
0.053 0.069
0.013 0.020
0.050 BSC
0.004 0.010
0.007 0.010
0.016 0.050
0 _ 8 _
0.010 0.020
0.228 0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
0.6
0.024
4.0
0.155
1.270
0.050
SCALE 6:1
mm
inches
SOIC ? 8
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
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