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| 型号： | MC34653EF |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 16/24页 |
| 文件大小： | 1649K |
| 描述： | IC CTRLR HOT SWAP NEG V 8-SOIC |
| 标准包装： | 98 |
| 类型： | 热交换开关 |
| 应用： | 通用 |
| 内部开关： | 是 |
| 电流限制： | 1A |
| 电源电压： | 36 V ~ 80 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 管件 |
Analog Integrated Circuit Device Data
16
Freescale Semiconductor
34653
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSIS FEATURES
rchived by Freescale Semiconductor, Inc., 2008
Table 5. Thermal Resistance Data
Type
Condition
Symbol Value Unit
Junction to Ambient
Single-layer board (1s), per JEDEC jesd51-2 with board (JESD51-3) horizontal
R
?/DIV>
JA
167
癈/W
Junction to Ambient
Four-layer board (2s2p), per JEDEC JESD51-2 with board (JESD51-3) horizontal
R
?/DIV>
JMA
115
癈/W
Junction to Ambient
Single-layer board with a 300 mm
2
radiator pad on its top surface, not standard JEDEC
145
癈/W
Junction to Ambient
Single-layer board with a 600 mm
2
radiator pad on its top surface, not standard JEDEC
143
癈/W
Junction to Ambient
Four-layer board with a via for each thermal lead, not standard JEDEC
111 ?/SPAN>C/W
Junction to Ambient
Four-layer board with a 300 mm
2
radiator pad on its top surface and a full array of vias
between radiator pad and top surface, not standard JEDEC
107 ?/SPAN>C/W
Junction to Ambient
Four-layer board with a 600 mm
2
radiator pad on its top surface and a full array of vias
between radiator pad and top surface, not standard JEDEC
107 ?/SPAN>C/W
Junction to Board
Thermal resistance between die and board per JEDEC JESD51-8
R
窲B
62 ?/SPAN>C/W
Junction to Case
Thermal resistance between die and case top
R
窲C
57 ?/SPAN>C/W
Junction to Package
Top
Temperature difference between package top and junction per JEDEC JESD51-2
?/DIV>
JT
18 ?/SPAN>C/W
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相关代理商/技术参数 |
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| MC34653EFR2 | 功能描述:热插拔功率分布 1A 8-LD NVHS RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MC34655 | 制造商:SPC Multicomp 功能描述:HEADER SQUARE PIN 2.54MM 5WAY 制造商:SPC Multicomp 功能描述:HEADER, SQUARE PIN, 2.54MM, 5WAY 制造商:SPC Multicomp 功能描述:WIRE-BOARD CONNECTOR HEADER 5POS, 2.54MM; Connector Type:Wire to Board; Series:2217; Contact Termination:Through Hole Vertical; Gender:Header; No. of Contacts:5; No. of Rows:1; Pitch Spacing:2.54mm; Contact Plating:Tin ;RoHS Compliant: Yes |
| MC34657 | 制造商:SPC Multicomp 功能描述:HEADER VERTICAL 2WAY 制造商:SPC Multicomp 功能描述:HEADER, VERTICAL, 2WAY 制造商:SPC Multicomp 功能描述:WIRE-BOARD CONNECTOR, RCPT, 2POS, 4.2MM; Series:2266(5566)S; Pitch Spacing:4.2mm; Contact Termination:Through Hole Vertical; No. of Contacts:2; No. of Rows:2; Connector Mounting:PCB; Gender:Receptacle; Contact Material:Copper Alloy ;RoHS Compliant: Yes |
| MC34659 | 制造商:SPC Multicomp 功能描述:HEADER VERTICAL 4WAY 制造商:SPC Multicomp 功能描述:HEADER, VERTICAL, 4WAY 制造商:SPC Multicomp 功能描述:WIRE-BOARD CONNECTOR, RCPT, 4POS, 4.2MM; Series:2266(5566)S; Pitch Spacing:4.2mm; Contact Termination:Through Hole Vertical; No. of Contacts:4; No. of Rows:2; Connector Mounting:PCB; Gender:Receptacle; Contact Material:Copper Alloy ;RoHS Compliant: Yes |
| MC34661 | 制造商:SPC Multicomp 功能描述:HEADER VERTICAL 6WAY 制造商:SPC Multicomp 功能描述:HEADER, VERTICAL, 6WAY 制造商:SPC Multicomp 功能描述:WIRE-BOARD CONNECTOR, RCPT, 6POS, 4.2MM; Series:2266(5566)S; Pitch Spacing:4.2mm; Contact Termination:Through Hole Vertical; No. of Contacts:6; No. of Rows:2; Connector Mounting:PCB; Gender:Receptacle; Contact Material:Copper Alloy ;RoHS Compliant: Yes |
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