参数资料
型号: MC34653EFR2
厂商: Freescale Semiconductor
文件页数: 16/24页
文件大小: 1649K
描述: IC CTRLR HOT SWAP NEG V 8-SOIC
标准包装: 2,500
类型: 热交换开关
应用: 通用
内部开关:
电流限制: 1A
电源电压: 36 V ~ 80 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
Analog Integrated Circuit Device Data
16
Freescale Semiconductor
34653
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSIS FEATURES
rchived by Freescale Semiconductor, Inc., 2008
Table 5. Thermal Resistance Data
Type
Condition
Symbol Value  Unit
Junction to Ambient
Single-layer board (1s), per JEDEC jesd51-2 with board (JESD51-3) horizontal
R
?/DIV>
JA
167
癈/W
Junction to Ambient
Four-layer board (2s2p), per JEDEC JESD51-2 with board (JESD51-3) horizontal
R
?/DIV>
JMA
115
癈/W
Junction to Ambient
Single-layer board with a 300 mm
2
 radiator pad on its top surface, not standard JEDEC
    145
癈/W
Junction to Ambient
Single-layer board with a 600 mm
2
 radiator pad on its top surface, not standard JEDEC
    143
癈/W
Junction to Ambient
Four-layer board with a via for each thermal lead, not standard JEDEC
    111   ?/SPAN>C/W
Junction to Ambient
Four-layer board with a 300 mm
2
 radiator pad on its top surface and a full array of vias
between radiator pad and top surface, not standard JEDEC
    107   ?/SPAN>C/W
Junction to Ambient
Four-layer board with a 600 mm
2
 radiator pad on its top surface and a full array of vias
between radiator pad and top surface, not standard JEDEC
    107   ?/SPAN>C/W
Junction to Board
Thermal resistance between die and board per JEDEC JESD51-8
R
窲B
62   ?/SPAN>C/W
Junction to Case
Thermal resistance between die and case top
R
窲C
57   ?/SPAN>C/W
Junction to Package
Top
Temperature difference between package top and junction per JEDEC JESD51-2
?/DIV>
JT
18   ?/SPAN>C/W
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