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参数资料
| 型号： | MC44BC374EJBR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 15/24页 |
| 文件大小： | 0K |
| 描述： | IC MODULATOR ANT BOOSTER 24TSSOP |
| 标准包装： | 2,500 |
| 类型： | 调制器 |
| 应用： | 机顶盒 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 带卷 (TR) |
MC44BC373/374 Technical Data
Application and Case Diagrams
Figure 15. TSSOP24 Package
Dim
Millimeters
Inches
Min
Max
Min
Max
A
7.70
7.90
0.303
0.311
B
4.30
4.48
0.169
0.176
C
—
0.95
—
0.037
D
0.05
0.15
0.002
0.006
F
0.51
0.71
0.020
0.028
G
0.65 BSC
0.026 BSC
H
0.27
0.37
0.011
0.015
J
0.09
0.18
0.003
0.007
J1
0.09
0.13
0.003
0.005
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.25
6.50
0.246
0.256
M
0o
8o
0o
8o
Note:
1. Dimensioning and Tolerancing per ANSI
Y14.5M, 1982.
Note:
2. Controlling dimension: Millimeters.
Note:
3. Dimensions A and B do not include mold flash
or protrusions and are measured at the parting line. Mold
flash or protrusions shall not exceed 0.15 (0.006) per
side.
Note:
4. Dimension is the length of terminal for soldering
to a substrate.
Note:
5. Terminal positions are shown for reference
only.
Note:
6. The lead width dimension does not include
Dambar protrusion. Allowable Dambar protrusion shall be
0.08 ( 0.003) total in excess of the lead width dimension at
maximum material condition. Dambar can not be located
on the lower radius or the foot. Minimum space between
protrusions and adjacent lead to be 0.14 (0.006).
CASE 940H-02
ISSUE A
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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