参数资料
型号: MC44BS374CAEFR2
厂商: Freescale Semiconductor
文件页数: 25/34页
文件大小: 0K
描述: IC AUDIO/VIDEO MODULATOR 16-SOIC
标准包装: 1
类型: NTSC/PAL 调制器
应用: 音频/视频,VCR,机顶盒
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC N
包装: 剪切带 (CT)
其它名称: MC44BS374CAEFR2CT
Packaging Instructions
MC44BS374CA Technical data
20 Packaging Instructions
Tape and reel packaging per 12MRH00360A issue Y with the following conditions applicable for Dual In-
Line SOP (SOIC) package. For lead free package meets Moisture Sensitivity Level 3 (dry pack required).
Figure 16. Dual In-line SOP (SOIC)
Component Orientation: Arrange parts with the pin 1 side closest to the tape's round sprocket holes on the
tape's trailing edge.
21 Marking Instructions
Bar marked part way across Pin 1 end of package.
Bar width 10 to 20 mils, length to be at least four
times Bar width. Bar placement may extend across
chamfer and dimple areas.
Pin 1 Dot or Dimple
1st line:
MCBS374CA (Part number coded on 10 digits)
2nd line:
Assembly site code AW (2 digits) followed by the
wafer lot code L (1 digit),
year Y (1 digit) and
work week WW (2 digits)
MCBS374CA
AWLYWW
Bar marked part way across Pin 1 end of package.
Bar width 10 to 20 mils, length to be at least four
times Bar width. Bar placement may extend across
chamfer and dimple areas.
Pin 1 Dot or Dimple
1st line:
MBS374CAEF (Part number coded on 10 digits)
2nd line:
Assembly site code AW (2 digits) followed by the
wafer lot code L (1 digit),
year Y (1 digit) and
work week WW (2 digits)
MBS374CAEF
AWLYWW
SO16NB Lead free package
SO16NB package
Freescale
Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc.
..
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