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参数资料
| 型号： | MC54HC32AJ |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 门电路 |
| 英文描述： | HC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14 |
| 封装： | CERAMIC, DIP-14 |
| 文件页数： | 5/7页 |
| 文件大小： | 160K |
| 代理商： | MC54HC32AJ |
MC54/74HC32A
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5
MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
MIN
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
J
K
L
M
N
0.785
0.280
0.200
0.020
0.065
0.015
0.170
15
°
0.040
0.750
0.245
0.155
0.015
0.055
0.008
0.125
0
°
0.020
19.94
7.11
5.08
0.50
1.65
0.38
4.31
15
°
1.01
19.05
6.23
3.94
0.39
1.40
0.21
3.18
0
°
0.51
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
14
8
1
7
-A-
-B-
-T-
SEATING
PLANE
F
G
N
K
C
L
M
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
J 14 PL
D 14 PL
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.715
0.770
18.16
19.56
B
0.240
0.260
6.10
6.60
C
0.145
0.185
3.69
4.69
D
0.015
0.021
0.38
0.53
F
0.040
0.070
1.02
1.78
G
0.100 BSC
2.54 BSC
H
0.052
0.095
1.32
2.41
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
L
0.300 BSC
7.62 BSC
M
0
10
0
10
N
0.015
0.039
0.39
1.01
_
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