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| 型号： | MC68302AG20C |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | IC MPU MULTI-PROTOCOL 144-LQFP |
| 标准包装： | 60 |
| 系列： | M683xx |
| 处理器类型： | M683xx 32-位 |
| 速度： | 20MHz |
| 电压： | 5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 144-LQFP |
| 供应商设备封装： | 144-LQFP（20x20） |
| 包装： | 托盘 |
| 产品目录页面： | 732 (CN2011-ZH PDF) |
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M68302FADS/D
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Product Brief
MC68302 Family Application Development System
M68302FADS
MOTOROLA, 1995
Microprocessor and Memory
Technologies Group
1
MC68302FADS PRODUCT INFORMATION
MOTOROLA
INTRODUCTION
The M68302FADS is an integrated Family Applications Development System (FADS) designed to aid hardware
and software developers of the MC68302, MC68LC302, MC68PM302, and MC68EN302 in quickly evaluating
and developing applications for these devices. All of the hardware resources needed to download and debug
application software are provided, such as large blocks of flash and static RAM for the processors, serial ports,
clock generation circuitry, logic analyzer connectors, expansion connectors as well as monitor/debugger
hardware and software. The logic analyzer connectors provide the user with access to all of the processors’
pins in order to monitor bus activity. The expansion connectors let the user attach hardware applications and to
use board resources to verify a design.
To serve as a convenient platform for software development, the M68302FADS is provided with a monitor/
debugger for the Integrated Multiprotocol Processor (IMP) section. The monitor/debugger provides operations
of memory dump and set (with optional disassembly of 68K instructions), single instruction execution,
breakpoints and downloads. The debugger interface can work together in separate Windows 3.0 DOS shells
on the same x86 based PC to communicate with the on-board IMP hardware. Future support for SUN platforms
is planned.
The M68302FADS board has sockets for and is shipped with the MC68302RC25, MC68LC302RC20,
MC68PM302RC20.
MC68302 FAMILY APPLICATION DEVELOPMENT SYSTEM FEATURES
General Features
—Supports the 68302 family of processors : MC68302, MC68LC302, MC68PM302 and
MC68EN302 (with and adaptor).
—On board IMP(68302) debugger software with host Debugger interface.
—Separate external clock generators for the IMP(68302)
—PCMCIA port connector with extender card to plug directly into PCMCIA sockets.
—Expansion connectors providing all the 68302 family device signals.
—68000 bus signals brought out to logic analyzer connectors.
—Single +5Vdc power supply with onboard 5V to +/-12Volt converter.
IMP(68302) Support Features Included
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For More Information On This Product,
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| MC68302AG20CB1 | 功能描述:微处理器 - MPU 68K INTGR COM PROC DMA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC68302AG25C | 功能描述:微处理器 - MPU 68K INTGR COM PROC DMA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC68302AG33C | 功能描述:微处理器 - MPU 68K INTGR COM PROC DMA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC68302CAG16VC | 功能描述:微处理器 - MPU 68K INTGR COM PROC DMA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC68302CAG16VCR2 | 功能描述:微处理器 - MPU 68K INTGR COM PROC DMA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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