参数资料
型号: MC68HC05P9AMDW
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 8-BIT, MROM, 2.1 MHz, MICROCONTROLLER, PDSO28
封装: SOIC-28
文件页数: 34/158页
文件大小: 3885K
代理商: MC68HC05P9AMDW
Specifications
Thermal Characteristics
Specifications
Thermal Characteristics
Power Considerations
The average chip junction temperature, T
J, in °C can be obtained from:
(1)
where:
T
A = ambient temperature in °C
θ
JA = package thermal resistance, junction to ambient in °C/W
P
D = PINT + PI
/O
P
INT = ICC × VCC = chip internal power dissipation
P
I
/O = power dissipation on input and output pins (user-determined)
For most applications, P
I
/O
P
INT and can be neglected.
Ignoring P
I
/O, the relationship between PD and TJ is approximately:
(2)
Solving equations (1) and (2) for K gives:
(3)
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring P
D (at equilibrium) for a
known T
A. Using this value of K, the values of PD and TJ can be obtained
by solving equations (1) and (2) iteratively for any value of T
A.
Table 29. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal Resistance
Plastic Dual In-Line Package (PDIP)
Small Outline Integrated Circuit (SOIC)
θ
JA
60
°C/W
T
J
T
A
P
D
θ
×
JA
()
+
=
P
D
K
T
J
273
°C
+
----------------------------------
=
KPD
TA
273
°C
+
() θ
JA
PD
()2
×
+
×
=
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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