参数资料
型号: MC68HC705C9ACFNE
厂商: Freescale Semiconductor
文件页数: 113/118页
文件大小: 0K
描述: IC MCU 8BIT 44-PLCC
标准包装: 26
系列: HC05
核心处理器: HC05
芯体尺寸: 8-位
速度: 2.1MHz
连通性: SCI,SPI
外围设备: POR,WDT
输入/输出数: 24
程序存储器容量: 16KB(16K x 8)
程序存储器类型: OTP
RAM 容量: 352 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 44-LCC(J 形引线)
包装: 管件
Electrical Specifications
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
94
Freescale Semiconductor
12.4 Power Considerations
The average chip-junction temperature, T
J, in °C, can be obtained from:
TJ = TA + (PD × θJA)
(1)
where:
T
A = Ambient temperature, °C
θ
JA = Package thermal resistance, junction to ambient, °C/W
P
D = PINT + PI
/O
P
INT = IDD × VDD watts (chip internal power)
P
I
/O = Power dissipation on input and output pins (user determined)
For most applications P
I
/O PINT and can be neglected.
The following is an approximate relationship between P
D and TJ (neglecting PJ):
P
D = K ÷ (TJ + 273 °C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D × (TA + 273 °C) + θJA × (PD)
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by
measuring P
D (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be
obtained by solving equations (1) and (2) iteratively for any value of T
A.
Figure 12-1. Test Load
VDD
C
R2
R1
TEST
POINT
(SEE TABLE)
SEE TABLE
V
DD = 4.5 V
Pins
R1
R2
C
PA7–PA0
PB7–PB0
PC7–PC0
PD5–PD0, PD7
3.26
2.38
50 pF
V
DD = 3.0 V
Pins
R1
R2
C
PA7–PA0
PB7–PB0
PC7–PC0
PD5–PD0, PD7
10.91
6.32
50 pF
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