参数资料
型号: MC68HC705E5DW
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDSO28
封装: SOIC-28
文件页数: 50/148页
文件大小: 620K
代理商: MC68HC705E5DW
MC68HC705E5 Rev. 1.0
General Release Specification
MOTOROLA
Mechanical Data
143
NON-DISCLOSURE
AGREEMENT
REQUIRED
General Release Specification — MC68HC705E5
Section 16. Mechanical Data
16.1 Contents
16.2 Introduction
This section describes the dimensions of the plastic dual in-line package
(PDIP) and small outline integrated circuit (SOIC) MCU packages.
16.3 28-Pin Plastic Dual-in-Line Package (Case 710-02)
0.100 BSC
0.600 BSC
2.54 BSC
15.24 BSC
MIN
MAX
MILLIMETERS
INCHES
DIM
36.45
13.72
3.94
0.36
1.02
1.65
0.20
2.92
0.51
37.21
14.22
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
15°
0.040
A
B
C
D
F
G
H
J
K
L
M
N
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
114
15
28
B
A
C
N
K
M
J
D
SEATING
PLANE
F
HG
L
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