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参数资料
| 型号： | MC7448HX1000LC |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360 |
| 文件页数： | 4/66页 |
| 文件大小： | 793K |
| 代理商： | MC7448HX1000LC |
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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
12
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 5 provides the package thermal characteristics for the MPC7448. For more information regarding
thermal management, see Section 9.7, “Power and Thermal Management Information.”
Table 6 provides the DC electrical characteristics for the MPC7448.
Table 5. Package Thermal Characteristics1
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
RθJA
26
C/W
2, 3
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
RθJMA
19
C/W
2, 4
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
RθJMA
22
C/W
2, 4
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
RθJMA
16
C/W
2, 4
Junction-to-board thermal resistance
RθJB
11
C/W
5
Junction-to-case thermal resistance
RθJC
< 0.1
C/W
6
Notes:
1. Refer to Section 9.7, “Power and Thermal Management Information,” for details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
3. Per JEDEC JESD51-2 with the single-layer board horizontal
4. Per JEDEC JESD51-6 with the board horizontal
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
Table 6. DC Electrical Specifications
At recommended operating conditions. See Table 4.
Characteristic
Nominal Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
Input high voltage
(all inputs)
1.5
VIH
OVDD × 0.65
OVDD + 0.3
V
2
1.8
OVDD × 0.65
OVDD + 0.3
2.5
1.7
OVDD + 0.3
Input low voltage
(all inputs)
1.5
VIL
–0.3
OVDD × 0.35
V
2
1.8
–0.3
OVDD × 0.35
2.5
–0.3
0.7
Input leakage current, all signals except
BVSEL0, LSSD_MODE, TCK, TDI, TMS,
TRST:
Vin = OVDD
Vin = GND
—Iin
—
50
– 50
A
2, 3
Input leakage current, BVSEL0,
LSSD_MODE, TCK, TDI, TMS, TRST:
Vin = OVDD
Vin = GND
—Iin
—
50
– 2000
A
2, 6
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相关代理商/技术参数 |
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|---|---|
| MC7448HX1000LD | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.15V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7448HX1000N | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7448 Hardware Specifications |
| MC7448HX1000NC | 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| MC7448HX1000ND | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.0V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7448HX1250N | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7448 Hardware Specifications |
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