参数资料
型号: MC74HC02ADR2
厂商: ON SEMICONDUCTOR
元件分类: 通用总线功能
英文描述: 50-A, 8 to 14-V Input, Wide-Output Adjust Power Module 20-DIP MODULE -40 to 85
中文描述: HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14
封装: SOIC-14
文件页数: 5/7页
文件大小: 195K
代理商: MC74HC02ADR2
MC54/74HC02A
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5
MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
MIN
0.750
0.245
0.155
0.015
0.055
0.100 BSC
MIN
19.05
6.23
3.94
0.39
1.40
2.54 BSC
MAX
0.785
0.280
0.200
0.020
0.065
MAX
19.94
7.11
5.08
0.50
1.65
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
J
K
L
M
N
0.015
0.170
15
°
0.040
0.008
0.125
0.300 BSC
0
°
0.020
0.38
4.31
15
°
1.01
0.21
3.18
7.62 BSC
0
°
0.51
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
14
8
1
7
-A-
-B-
-T-
SEATING
PLANE
F
G
N
K
C
L
M
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
J
14 PL
D
14 PL
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.715
0.240
0.145
0.015
0.040
0.100 BSC
0.052
0.008
0.115
0.300 BSC
0
0.015
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
MILLIMETERS
INCHES
2.54 BSC
1.32
0.20
2.92
7.62 BSC
0
0.39
0.095
0.015
0.135
2.41
0.38
3.43
10
10
1.01
0.039
相关PDF资料
PDF描述
MC74HC02ADT Quad 2-Input NOR Gate
MC74HC02AN Quad 2-Input NOR Gate
MC74HC02ADT Quad 2-Input NOR Gate
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