参数资料
| 型号： | MC74HC04AFEL |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/7页 |
| 文件大小： | 0K |
| 描述： | IC INVERTER HEX LSTTL 14-SOEIAJ |
| 产品变化通告： | Product Obsolescence 24/Jan/2011 |
| 标准包装： | 2,000 |
| 系列： | 74HC |
| 逻辑类型： | 逆变器，缓冲器 |
| 电路数： | 6 |
| 输入数： | 1 |
| 电源电压： | 2 V ~ 6 V |
| 电流 - 静态（最大值）： | 1µA |
| 输出电流高，低： | 5.2mA，5.2mA |
| 逻辑电平 - 低： | 0.5 V ~ 1.8 V |
| 逻辑电平 - 高： | 1.5 V ~ 4.2 V |
| 额定电压和最大 CL 时的最大传播延迟： | 13ns @ 6V，50pF |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | SOEIAJ-14 |
| 封装/外壳： | 14-SOIC（0.209"，5.30mm 宽） |
| 包装： | 带卷 (TR) |
MC74HC04A
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air,
SOIC Package
TSSOP Package
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
SOIC or TSSOP Package
260
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be
taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, Vin and
Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either GND or VCC). Unused outputs must be left open.
Derating SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 1)
VCC = 4.5 V
VCC = 6.0 V
0
1000
500
400
ns
ORDERING INFORMATION
Device
Package
Shipping
MC74HC04ADG
SOIC14
(PbFree)
55 Units / Rail
MC74HC04ADR2G
SOIC14
(PbFree)
2500 / Tape & Reel
MC74HC04ADTR2G
TSSOP14
(PbFree)
2500 / Tape & Reel
NLV74HC04ADG*
SOIC14
(PbFree)
55 Units / Rail
NLV74HC04ADR2G*
SOIC14
(PbFree)
2500 / Tape & Reel
NLV74HC04ADTR2G*
TSSOP14
(PbFree)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable
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相关代理商/技术参数 |
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| MC74HC04AFELG | 功能描述:变换器 2-6V CMOS Hex RoHS:否 制造商:NXP Semiconductors 电路数量:6 逻辑系列:74ABT 逻辑类型:BiCMOS 高电平输出电流:- 15 mA 低电平输出电流:20 mA 传播延迟时间:2.2 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 工作温度范围: 封装 / 箱体:DIP-14 封装:Tube |
| MC74HC04AFG | 功能描述:变换器 2-6V CMOS Hex RoHS:否 制造商:NXP Semiconductors 电路数量:6 逻辑系列:74ABT 逻辑类型:BiCMOS 高电平输出电流:- 15 mA 低电平输出电流:20 mA 传播延迟时间:2.2 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 工作温度范围: 封装 / 箱体:DIP-14 封装:Tube |
| MC74HC04AFL1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC04AFL2 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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