参数资料
| 型号： | MC74HC164ANG |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/11页 |
| 文件大小： | 0K |
| 描述： | IC SHIFT REG 8BIT SER/PAR 14-DIP |
| 标准包装： | 500 |
| 系列： | 74HC |
| 逻辑类型： | 移位寄存器 |
| 输出类型： | 标准 |
| 元件数： | 1 |
| 每个元件的位元数： | 8 |
| 功能： | 串行至并行 |
| 电源电压： | 2 V ~ 6 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 14-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 14-PDIP |
| 包装： | 管件 |
| 产品目录页面： | 1122 (CN2011-ZH PDF) |
| 其它名称： | MC74HC164ANGOS |
MC74HC164A
http://onsemi.com
3
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air,
Plastic DIP
SOIC Package
TSSOP Package
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
260
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to
GND)
0
VCC
V
TA
Operating Temperature, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 1)
VCC = 4.5 V
VCC = 6.0 V
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Test Conditions
VCC
V
Guaranteed Limit
Unit
55_C to
25_C
v 85_C
v 125_C
VIH
Minimum HighLevel Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum LowLevel Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
VOH
Minimum HighLevel Output
Voltage
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL
|Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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| MC74HC164N | 制造商:Motorola Inc 功能描述: 制造商:Texas Instruments 功能描述: |
| MC74HC165AD | 功能描述:计数器移位寄存器 8bit Serial/Parallel RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| MC74HC165ADG | 功能描述:计数器移位寄存器 8bit Serial/Parallel In Serial Out RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| MC74HC165ADR2 | 功能描述:计数器移位寄存器 8bit Serial/Parallel RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| MC74HC165ADR2G | 功能描述:计数器移位寄存器 8bit Serial/Parallel In Serial Out RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
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