参数资料
型号: MC74HC165AFEL
厂商: ON Semiconductor
文件页数: 13/13页
文件大小: 0K
描述: IC SHIFT REGISTER 8BIT 16-SOEIAJ
产品变化通告: Product Obsolescence 24/Jan/2011
标准包装: 2,000
系列: 74HC
逻辑类型: 移位寄存器
输出类型: 差分
元件数: 1
每个元件的位元数: 8
功能: 并行或串行至串行
电源电压: 2 V ~ 6 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.209",5.30mm 宽)
供应商设备封装: 16-SOEIAJ
包装: 带卷 (TR)
MC74HC165A
http://onsemi.com
9
PACKAGE DIMENSIONS
QFN16, 2.5x3.5, 0.5P
CASE 485AW
ISSUE O
DIM
MIN
MAX
MILLIMETERS
A
A1
0.00
0.05
A3
b
0.20
0.30
D
2.50 BSC
D2
0.85
1.15
E
3.50 BSC
E2
e
0.50 BSC
K
0.20
---
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
0.20 REF
b
D2
L
PIN ONE
E2
1
8
15
10
D
E
B
A
C
0.15
C
0.15
2X
e
2
16X
0.10 C
0.05 C
A B
NOTE 3
A
16X
K
A1
(A3)
SEATING
PLANE
C
0.08
C
0.10
0.80
1.00
L
0.35
0.45
1.85
2.15
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.80
3.80
1.10
0.50
0.60
16X
0.30
16X
DIMENSIONS: MILLIMETERS
1
REFERENCE
TOP VIEW
SIDE VIEW
NOTE 4
C
0.15 C A B
DETAIL A
BOTTOM VIEW
e/2
L1
---
0.15
2.10
PITCH
PACKAGE
OUTLINE
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