参数资料
| 型号： | MC74HC259ADR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/9页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 3ST 8INP 16-SOIC |
| 标准包装： | 2,500 |
| 系列： | 74HC |
| 逻辑类型： | D 型，可寻址 |
| 电路： | 1:8 |
| 输出类型： | 标准 |
| 电源电压： | 2 V ~ 6 V |
| 独立电路： | 1 |
| 延迟时间 - 传输： | 25ns |
| 输出电流高，低： | 5.2mA，5.2mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 带卷 (TR) |
MC74HC259A
http://onsemi.com
2
Figure 1. Logic Diagram
ADDRESS
INPUTS
A0
A1
A2
DATA IN
RESET
ENABLE
14
15
13
3
2
1
12
11
10
9
7
6
5
4
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
PIN 16 = VCC
PIN 8 = GND
NONINVERTING
OUTPUTS
LATCH SELECTION TABLE
Address Inputs
Latch Addressed
A2
A1
A0
L
H
L
H
L
H
L
H
L
H
L
H
L
H
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to +7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation in Still Air,
SOIC Package
TSSOP Package
500
450
mW
Tstg
Storage Temperature
65 to + 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+125
°C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 2)
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
0
1000
600
500
400
ns
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74HC259ADTG | 功能描述:编码器、解码器、复用器和解复用器 IC MULTIPLEXER 3ST 8INPUT RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| MC74HC259ADTR2 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:ON Semiconductor 功能描述: |
| MC74HC259ADTR2G | 功能描述:编码器、解码器、复用器和解复用器 IC MULTIPLEXER 3ST 8INPUT RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| MC74HC259D | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC259DR2 | 制造商:Motorola Inc 功能描述: |
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