参数资料
| 型号： | MC74HC30ADTR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/5页 |
| 文件大小： | 0K |
| 描述： | IC GATE NAND 4INPUT 14-TSSOP |
| 标准包装： | 2,500 |
| 系列： | 74HC |
| 逻辑类型： | 与非门 |
| 电路数： | 1 |
| 输入数： | 8 |
| 电源电压： | 2 V ~ 6 V |
| 电流 - 静态（最大值）： | 2µA |
| 输出电流高，低： | 5.2mA，5.2mA |
| 逻辑电平 - 低： | 0.5 V ~ 1.8 V |
| 逻辑电平 - 高： | 1.5 V ~ 4.2 V |
| 额定电压和最大 CL 时的最大传播延迟： | 30ns @ 6V，50pF |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 14-TSSOP |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 包装： | 带卷 (TR) |
MC74HC30A
http://onsemi.com
4
PACKAGE DIMENSIONS
TSSOP14
CASE 948G01
ISSUE B
DIM MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
1.20
0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60 0.020 0.024
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1
0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
___
_
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V S
T
L
U
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
J J1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U
0.15 (0.006) T
V
14X
REF
K
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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