参数资料
| 型号： | MC74HC365ADG |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/8页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER NONINV HEX 3ST 16SOIC |
| 标准包装： | 48 |
| 系列： | 74HC |
| 逻辑类型： | 缓冲器/线路驱动器，非反相 |
| 元件数： | 1 |
| 每个元件的位元数： | 6 |
| 输出电流高，低： | 7.8mA，7.8mA |
| 电源电压： | 2 V ~ 6 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC N |
| 包装： | 管件 |
Semiconductor Components Industries, LLC, 2009
December, 2009 Rev. 2
1
Publication Order Number:
MC74HC365A/D
MC74HC365A
Hex 3-State Noninverting
Buffer with Common
Enables
HighPerformance SiliconGate CMOS
The MC74HC365A is identical in pinout to the LS365. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device is a highspeed hex buffer with 3state outputs and two
common activelow Output Enables. When either of the enables is
high, the buffer outputs are placed into highimpedance states. The
HC365A has noninverting outputs.
Features
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 90 FETs or 22.5 Equivalent Gates
These are PbFree Devices*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
MARKING
DIAGRAMS
SOIC16
D SUFFIX
CASE 751B
TSSOP16
DT SUFFIX
CASE 948F
1
16
PDIP16
N SUFFIX
CASE 648
1
16
1
16
1
16
MC74HC365AN
AWLYYWWG
1
16
HC365AG
AWLYWW
HC
365A
ALYWG
G
1
16
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= PbFree Package
(Note: Microdot may be in either location)
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
相关PDF资料 |
PDF描述 |
|---|---|
| MC74HCT125ADTR2G | IC BUFFER NONIN QUAD 3ST 14TSSOP |
| MC74HCT125ADR2G | IC BUFFER NONINV QUAD 3ST 14SOIC |
| MC74HCT125ADG | IC BUFFER NONINV QUAD 3ST 14SOIC |
| MC74HC365ADTR2G | IC BUFFER NONINV HEX 3ST 16TSSOP |
| QMS07DH-N | FRONT PANEL 4TE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74HC365ADR2 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC365ADR2G | 功能描述:缓冲器和线路驱动器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| MC74HC365ADT | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC365ADTG | 功能描述:缓冲器和线路驱动器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| MC74HC365ADTR2G | 功能描述:缓冲器和线路驱动器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
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