参数资料
| 型号： | MC74HC373AFG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/9页 |
| 文件大小： | 0K |
| 描述： | IC LATCH TRANSP OCT 3ST 20SOEIAJ |
| 产品变化通告： | 1Q2012 Discontinuation 30/Mar/2012 |
| 标准包装： | 40 |
| 系列： | 74HC |
| 逻辑类型： | D 型透明锁存器 |
| 电路： | 8:8 |
| 输出类型： | 三态 |
| 电源电压： | 2 V ~ 6 V |
| 独立电路： | 1 |
| 延迟时间 - 传输： | 21ns |
| 输出电流高，低： | 7.8mA，7.8mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | SOEIAJ-20 |
| 包装： | 管件 |
MC74HC373A
http://onsemi.com
3
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 35
mA
ICC
DC Supply Current, VCC and GND Pins
± 75
mA
PD
Power Dissipation in Still Air,
Plastic DIP
SOIC Package
TSSOP Package
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC, SSOP or TSSOP Package)
260
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 1)
VCC = 4.5 V
VCC = 6.0 V
0
1000
500
400
ns
ORDERING INFORMATION
Device
Package
Shipping
MC74HC373ANG
PDIP20
(PbFree)
18 Units / Box
MC74HC373ADWG
SOIC20 WIDE
(PbFree)
38 Units / Rail
MC74HC373ADWR2G
SOIC20 WIDE
(PbFree)
1000 Units / Reel
MC74HC373ADTG
TSSOP20*
75 Units / Rail
MC74HC373ADTR2G
TSSOP20*
2500 Units / Reel
MC74HC373AFG
SOEIAJ20
(PbFree)
40 Units / Rail
MC74HC373AFELG
SOEIAJ20
(PbFree)
2000 Units / Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently PbFree.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74HC373AFI | 制造商:ON Semiconductor 功能描述: |
| MC74HC373AFL1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC373AFR1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC373AH | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC373AN | 功能描述:闭锁 2-6V Transparent RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
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