参数资料
| 型号： | MC74HC4067ADWG |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/12页 |
| 文件大小： | 0K |
| 描述： | IC MUX/DEMUX/QUAD SWITCH 24SOIC |
| 标准包装： | 30 |
| 功能： | 多路复用器/多路分解器 |
| 电路： | 1 x 4:1 |
| 导通状态电阻： | 140 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 2 V ~ 6 V |
| 电流 - 电源： | 4µA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC |
| 包装： | 管件 |
MC74HC4067A
http://onsemi.com
12
PACKAGE DIMENSIONS
TSSOP24 7.8x4.4, 0.65P
CASE 948H
ISSUE B
DIM
D
MIN
MAX
7.90
MILLIMETERS
E1
4.30
4.50
A
1.20
A1
0.05
0.15
L
0.50
0.75
e
0.65 BSC
c
0.09
0.20
b
0.19
0.30
L2
0.25 BSC
M
0
8
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M,
1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL BE 0.08 MAX AT MMC. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15
PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED
AT DATUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE
SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE
BODY.
7.70
---
24X
1.15
24X
0.42
0.65
DIMENSIONS: MILLIMETERS
PITCH
SOLDERING FOOTPRINT
E
6.40 BSC
6.70
RECOMMENDED
L
L2
GAUGE
DETAIL A
PLANE
C
DETAIL A
M
END VIEW
c
H
0.10
SEATING
PLANE
SIDE VIEW
A
C
0.05 C
C
24X
A1
PIN 1
REFERENCE
D
E1
24X
b
e
B
M
0.10
A
C
TOP VIEW
B
0.15 C
112
13
24
A
B
NOTE 3
2X 12 TIPS
E
NOTE 6
NOTE 4
NOTE 5
S
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MC74HC4067A/D
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