参数资料
型号: MC74HC4852ANG
厂商: ON Semiconductor
文件页数: 6/16页
文件大小: 0K
描述: IC MUX/DEMUX DUAL 4X1 16DIP
标准包装: 500
系列: 74HC
功能: 多路复用器/多路分解器
电路: 2 x 4:1
导通状态电阻: 600 欧姆
电压电源: 单电源
电压 - 电源,单路/双路(±): 2 V ~ 6 V
电流 - 电源: 20µA
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 16-DIP(0.300",7.62mm)
供应商设备封装: 16-DIP
包装: 管件
MC74HC4851A, MC74HC4852A
http://onsemi.com
14
PACKAGE DIMENSIONS
SOIC16
D SUFFIX
CASE 751B05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16
9
SEATING
PLANE
F
J
M
R X 45_
G
8 PL
P
B
A
M
0.25 (0.010)
B S
T
D
K
C
16 PL
S
B
M
0.25 (0.010)
A S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
____
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
16
89
8X
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