参数资料
| 型号： | MC74HC573AFELG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/7页 |
| 文件大小： | 0K |
| 描述： | IC LATCH TRANSP OCTAL 20-SOEIAJ |
| 产品变化通告： | 1Q2012 Discontinuation 30/Mar/2012 |
| 标准包装： | 2,000 |
| 系列： | 74HC |
| 逻辑类型： | D 型透明锁存器 |
| 电路： | 8:8 |
| 输出类型： | 三态 |
| 电源电压： | 2 V ~ 6 V |
| 独立电路： | 1 |
| 延迟时间 - 传输： | 26ns |
| 输出电流高，低： | 7.8mA，7.8mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | SOEIAJ-20 |
| 包装： | 带卷 (TR) |
MC74HC573A
http://onsemi.com
3
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 35
mA
ICC
DC Supply Current, VCC and GND Pins
± 75
mA
PD
Power Dissipation in Still Air,
Plastic DIP
SOIC Package
TSSOP Package
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, TSSOP or SOIC Package)
260
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
Derating Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: 6.1 mW/°C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 1)
VCC = 4.5 V
VCC = 6.0 V
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Test Conditions
VCC
V
Guaranteed Limit
Unit
– 55 to
25_C
v 85_C
v 125_C
VIH
Minimum HighLevel Input Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum LowLevel Input Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1 8
0.5
0.9
1.35
1.8
V
VOH
Minimum HighLevel Output
Voltage
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL
|Iout| ≤ 2.4mA
|Iout| v 6.0 mA
|Iout| v 7.8 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.2
3.7
5.2
VOL
Maximum LowLevel Output
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
V
Vin = VIH or VIL
|Iout| ≤ 2.4mA
|Iout| v 6.0 mA
|Iout| v 7.8 mA
3.0
4.5
6.0
0.26
0.33
0.4
Iin
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
mA
IOZ
Maximum ThreeState Leakage
Current
Output in HighImpedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
– 0.5
– 5.0
– 10
mA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
IIoutI = 0 mA
6.0
4.0
40
160
mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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| MC74HC573AFL1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:ON Semiconductor 功能描述: |
| MC74HC573AH | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:ON Semiconductor 功能描述: |
| MC74HC573AN | 功能描述:闭锁 2-6V Transparent RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
| MC74HC573ANG | 功能描述:闭锁 2-6V Transparent Non-Inverting RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
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